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標題: 板狀熱管用於筆記型電腦散熱之研究
Studies on the Cooling of Notebook PC by a Plate Type Heat Pipe
作者: 沈志秋
Zhi, Qiu-Chen
關鍵字: 熱管;heat pipe;液氣分流;熱虹吸
出版社: 機械工程學系

The purpose of this investigation was to fabrication a new plate-shape heat pipe and test experimentally the thermal performance of this heat pipe.
Heat pipe is a device that makes use of the property of phase change between liquid and vapor to transport mass thermal energy. Because of the boiling and condensation during the change phase, it may obtain relatively larger heat-transfer coefficient than that in the liquid or vapor force convection. Therefore, heat pipes are commonly found in the applications such as heat dissipation, heat spreading, energy storage, heat recovery and improvement of the cooling speed of cooked foods …etc.
Due to the fact that semiconductor industry has been developed unceasingly in recent years, the heat dissipating effectiveness for the miniaturized and integrated high power electronic devices have become more and more important. Correspondingly, CPU dissipation methods have successively made progress from natural convection, forced convection, to heat pipe .In the foreseeable future, the size of heat-sink will decide the size of the electronic products. Base on this concept, this study attempted to design a new heat dissipation device in which the back plate of the LCD monitor of a notebook computer was utilized as a natural cooling dissipater. The undesirable heat from CPU was transported by heat pipe into the back plate where it may easily be dissipated. This offered us the advantage of economizing the required space for fan and heat sink .In addition, this save the power consumption of fan and decreased the noises. Because the plate-shape heat pipe itself served as one kind of heat-sink, the thermal resistance of heat transport was greatly reduced. In this thesis, a new plate-shape heat pipe, by virtue of verifying and comparing the results of its theoretical analyses and experimental tests, was proved to be feasible. This heat dissipater s maximum heat removal capability was 24W when outside air temperature was 31℃ and plate temperature was kept below 70℃.
Appears in Collections:機械工程學系所

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