Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/2686
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dc.contributor.advisor簡瑞與zh_TW
dc.contributor.advisorRei-Yu Cheinen_US
dc.contributor.author黃冠銘zh_TW
dc.contributor.authorHuang, Guan-Mingen_US
dc.date2003zh_TW
dc.date.accessioned2014-06-05T11:43:47Z-
dc.date.available2014-06-05T11:43:47Z-
dc.identifier.urihttp://hdl.handle.net/11455/2686-
dc.description.abstract本研究之目的,首先擬以散熱鰭片為基礎,討論微流道熱沉散熱的設計與性能分析,其中並藉由純水與不同濃度的而粒徑為100nm的銅懸浮粒子的奈米流體之熱傳特性之改善,探討其未來發展與應用上的限制。微流道熱交換器的設計和最佳化過程顯示最佳的流道幾何可獲得最低的熱阻,並對於最佳化的組態時微熱沉的比較結果顯示奈米冷卻的優勢:當使用奈米流體時,熱阻可大幅減少而熱通量相對增加,並且可在室溫的條件下得到性能極佳的矽質微流道熱沉。 再者,說明熱電致冷器在電子元件趨向微小化的趨勢下,從冷卻(凍)性能的需求以討論其未來的應用可行性。最後,研究中將整合熱電致冷器與微流道熱沉,並討論此主動式冷卻系統應用於電子元件散熱之可行性。zh_TW
dc.description.abstractThe design of a microchannel heat sink (MCHS) and its performance in dissipating heat with pure water and nanofluid with 100nm-sized Copper particles in different volume fractions are presented. The paper is based on the fin approach to investigate the improvement of heat transfer between the pure water and nanofluid. By means of the procedure of the geometric optimization and other design discussions, nanofluid shows the superiority to water and leads to reduce the thermal resistance of microchannel heat sink greatly. Furthermore, present study addressed the application of thermoelectric cooler (TEC) in the recent trend with denser electronic cooling device. Finally, the design of MCHS integrated into the TEC and the development and applicability of the active cooling system could be discussed.en_US
dc.description.tableofcontents中文摘要………………………………………………………………Ⅰ 英文摘要………………………………………………………………Ⅱ 目錄……………………………………………………………………Ⅲ 圖表目錄………………………………………………………………Ⅴ 符號說明……………………………………………………………VIII 第一章 緒論……………………………………………………………1 1.1 前言………………………………………………………………1 1.2 研究動機…………………………………………………………4 第二章 微流道熱沉理論模式…………………………………………6 2.1 散熱鰭片理論…………………………………………………6 2.2 微流道熱沉……………………………………………………8 2.3 奈米流體對於熱傳的性能改善………………………………11 2.3.1 奈米流體的發展……………………………………………12 2.3.2 理論描述…………………………………………………12 第三章 微流道熱沉的性能討論……………………………………18 3.1 微流道熱沉熱阻的設計…………………………………18 3.2 純水與奈米流體的熱流性質………………………………18 3.2.1 純水與奈米流體熱傳性質的差異………………………18 3.2.2 wfin與wch對熱阻關係的等高線圖………………………23 3.2.3 鰭片長度與流道寬度對熱阻的影響……………………23 3.2.4 研究數據的比較…………………………………………24 3.2.5 最佳化設計………………………………………………25 3.3 微流道熱沉的角色與優缺點………………………………26 第四章 熱電致冷器原理與應用………………………………………28 4.1 微電子元件冷卻的趨勢………………………………………28 4.2 熱電致冷器的原理與發展…………………………………28 4.3 熱電致冷器的設計與模型建立……………………………32 4.4 熱電致冷器的優缺點與發展性………………………………34 第五章 系統操作計算…………………………………………………36 5.1 熱電致冷器的設計……………………………………………36 5.2 微流道熱沉的設計……………………………………………38 第六章 討論與未來展望………………………………………………40 6.1 結果討論………………………………………………………40 6.2 未來展望………………………………………………………41 參考文獻………………………………………………………………43zh_TW
dc.language.isoen_USzh_TW
dc.publisher機械工程學系zh_TW
dc.subjectMicrochannel Heat Sinken_US
dc.subject微流道熱沉zh_TW
dc.subjectNanofluiden_US
dc.subjectThermoelectric Cooleren_US
dc.subjectThermal Resistanceen_US
dc.subject奈米流體zh_TW
dc.subject熱電致冷器zh_TW
dc.subject熱阻zh_TW
dc.title微流道熱沉性能分析及其於熱電電子散熱器之應用zh_TW
dc.titlePerformance Analysis of Microchannel Heat Sink and Its Application in Electronic Cooling Using Thermoelectric Coolersen_US
dc.typeThesis and Dissertationzh_TW
item.languageiso639-1en_US-
item.openairetypeThesis and Dissertation-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.fulltextno fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
Appears in Collections:機械工程學系所
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