Please use this identifier to cite or link to this item:
Study of Micro-Milling for PZT Thin Film Using Diamond Coated Tool
|關鍵字:||微銑削;Micromilling;鋯鈦酸鉛;PZT;鑽石塗層刀具;PZT;CVD diamond coated tool||出版社:||機械工程學系所||引用:|| C. C. Lee, C. C. Wu, G. Z. Cao, and I. Y. Shen, 2005, A scale-up prototype of PZT thin-film actuators for scanning endoscopes, 2005 3rd IEEE/EMBS Special Topic Conference on Microtechnology in Medicine and Biology, Vol. 2005, pp. 241-244  R. Komanduri, D. A. Lucca, and Y. Tani, 1997, Technological Advances in Fine Abrasive Processes, Annals of the CIRP, Vol. 46, Issue 2, pp. 545–596.  P. W. Bridgman, 1953, Effects of Very High Pressures on Glass, Journal of Applied Physics, Vol. 24, pp.405-413.  B. Lawn, R. Wilshaw, 1975, Indentation fracture: principles and applications, Journal of Materials Science, Vol. 10, Issue 6, pp. 1049-1081.  F. Z. Fang, L. J. Chen, Ultra-precision cutting for ZKN7 glass, 2000, CIRP Annals - Manufacturing Technology, Vol. 49, pp. 17–20.  S. Shimada, N. Ikawa, T. Inamura, N. Takezawa, H. Ohmori, T. Sata, 1995, Brittle– ductile transition phenomena in microindentation and micromachining, Annals of CIRP, Vol. 44, Issue 1, pp. 523–526.  T. G. Bifano, T. A. Dow, R. O. Scattergood, 1991, Ductile-regime grinding: a new technology for machining brittle materials, Journal of Engineering for Industry, Vol. 113, pp. 184–189.  D. B. Marshall, B. R. Lawn, 1986, Indentation of brittle materials, Micro-indentation Techniques in Materials Science and Engineering, American Society for Testing and Materials, Philadelphia, pp. 26–46.  G. K. Thimmaiah, P. C. Harish, J. A. Pattena, C. J. Brando, D. T. Marusichb, 2001, Numerical simulation of ductile machining of silicon nitride with a cutting tool of defined geometry, Machining Science and Technology, Vol.5, pp. 341–352.  J. A. Patten and W. Gao, 2001，Extreme Negative Rake Angle Technique for Single Point Diamond Nano-Cutting of Silicon, Journal of the International Societies for Precision Engineering and Nanotechnology, Vol. 25, pp. 165–167.  T. P. Leung, W. B. Lee, X. M. Lu, 1998, Diamond turning of silicon substrates in ductile-regime, Journal of Materials Processing Technology, Vol. 73, pp. 42–48.  M. B. Cai, X. P. Li, M. Rahman, 2007, Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamic simulation, International Journal of Machine Tools & Manufacture, Vol. 47, pp. 75–80.  K. Cheng, X. Luo, R. Ward, R. Holt, 2003, Modeling and simulation of the tool wear in nanometric cuttingWear, Wear, Vol. 255, pp. 1427–1432.  M. Sharif Uddin, K. H. W. Seah, M. Rahman, X. P. Li, K. Liu, 2007, Performance of single crystal diamond tools in ductile mode cutting of silicon, Journal of Materials Processing Technology, Vol. 185, pp. 24–30.  G. Newby, S. Venkatachalam, S. Y. Liang, 2007, Empirical analysis of cutting force constants in micro-end-milling operations, Journal of Materials Processing Technology, Vol. 192–193, pp. 41–47.  M. Arif, M. Rahman, Y.S. Wong, 2011, Analytical model to determine the critical feed per edge for ductile–brittle transition in milling process of brittle materials, International Journal of Machine Tools & Manufacture, Vol. 51, pp. 170–181.  T. Matsumura, T. Hiramatsu, T. Shirakashi, T. Muramatsu, 2005, A study on cutting force in the milling process of glass, Journal of manufacturing processes, Vol. 17, Issue 2, pp. 102–108.  M. Arif, M. Rahman, Y. S. Wong, 2011, Ultraprecision ductile mode machining of glass by micromilling process, Journal of Manufacturing Processes, Vol. 13, pp. 50–59.  T. Matsumura, T. Ono, 2008, Cutting process of glass with inclined ball end mill. Journal of Material Processing Technology, Vol. 200, pp. 356–363.  T. Ono, T. Matsumura, 2008, Influence of tool inclination on brittle fracture in glass cutting with ball end mills, Journal of Material Processing Technology, Vol. 202, pp. 61–69.  K. Foy, Z. Wei, T. Matsumura, Y. Huang, 2009, Effect of tilt angle on cutting regime transition in glass micromilling, International Journal of Machine Tools & Manufacture, Vol. 49 pp. 315–324.  宋孟桓，2008，鋯鈦酸鉛薄膜之性質量測及其在發電裝置應用之研究，國立中興大學機械工程研究所碩士論文。  饒珮瑩，2003，利用微機電技術設計及製作壓電式微型加速計，國立成功大學航空太空工程研究所碩士論文。  李正中，1999，薄膜光學與鍍膜技術，藝軒圖書出版社。  M. C. Shaw, 2005, Metal Cutting Principles, Oxford University Press.  C. J. Kim, J. R. Mayor, J. Ni, 2004, A Static Model of Chip Formation in Microscale Milling, Journal of Manufacturing science and engineering, Vol. 126, pp. 710–718.  張煌權，2001，包含側邊及底面犁切力之端銑及面銑力模式，國立成功大學機械研究所碩士論文。  J. Chae, S. S. Park, T. Freiheit, 2006, Investigation of micro-cutting operations, International Journal of Machine Tools & Manufacture, Vol. 46, pp. 313–332.  M. E. Martellotti, 1941, An Analysis of the Milling Process, Transaction of ASME, Vol. 63, pp. 677–700.  X. Li, 2002, A Brief Review: Acoustic Emission Method for Tool Wear Monitoring During Turning, International Journal of Machine Tool & Manufacture, Vol. 42, pp. 157–165.||摘要:||
The demand for manufacturing complex device made of brittle material increases dramatically due to its specific characteristics compared metal and polymer materials. However, the low machinability of brittle material still challenges its applications on the mass production line. In tradition, semiconductor process is used for machining the thin film made of brittle material. However, low efficiency and quality on etching PZT thin film increase the cost and flexibility for pattern generation. Therefore, how to make a device made of PZT material more efficiency and flexible draws an attention lately. This research focus on the study of machinability for PZT thin film using diamond coated end mill to develop a more efficiency and lower cost solution to manufacturing the PZT thin film device.
The effect of the cutting parameters such as depth of cut, feed rate, tool geometry, cutting velocity on the brittle/ductile chip generation is discussed, as well as the effect from the tool wear level. The critical depth of cut and critical feed rate for generating the ductile chip was determined based on the observation of chip type and chipping on the top side surface of machined slot. Except for the PZT thin film, the silicon wafer was also investigated as a reference with the same cutting condition. To investigate the cutting velocity effect on machining performance, three size of cutting tool was used in this study to generate different cutting velocity. In monitoring the transition from brittle chip to ductile chip, a Kistler dynamometer was used to measure the cutting force change during cutting.
The experimental results show that tool life can be improved by coating diamond thin film on the tool in cutting brittle material. By compared to silicon wafer, PZT thin film provides the lower value of critical depth of cut for ductile chip generation. At the same time, higher value of critical depth of cut was observed by implementing CVD diamond coated tool than diamond grinder with the same diameter as CVD diamond coated tool. In the analysis of tool wear effect on the ductile mode machining, tool wear makes the chip generation closer to ductile mode machining than sharp tool with the same depth of cut. . With the tool wear increases, the higher cutting speed will make the ductile mode machining available than the lower speed cutting. To investigate the two sides of generated slot, the side with up milling provides the higher value of critical depth of cut than down milling side.
|Appears in Collections:||機械工程學系所|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.