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Study of Novel Heat Dissipation System Applied to LED Lighting
|關鍵字:||發泡金屬;Metal foam;LED照明;發光二極體;散熱器;熱阻;LED Lighting;Heat sink;Thermal resistance||出版社:||機械工程學系所||引用:||參考文獻  J. Lin, High-brightness LED market output value to grow 15.8% on year in 2013, Digitimes research, Taipei, March 2013. http://www.digitimes.com.  Solid-state lighting research and development: multi-year program plan, U.S. Department of Energy April 2012. http://apps1.eere.energy.gov.  Energy Star program requirements product specification for luminaires (light fixtures), eligibility criteria version 1.1. http://www.energystar.gov.  Thermal management of Cree XLamp LEDs; Cree XLamp LED thermal management. http://www.cree.com.  Tao Xuehui, Chen Huanting, Hui S.Y. , Modeling of junction temperature and forward voltage of LED devices with externally measurable variables, IEEE ECCE, (2012) 4242-4245.  Wang Fu-Kwun, Chu Tao-Peng, Lifetime predictions of LED-based light bars by accelerated degradation test, Microelectron Reliab., 52, (2012) 1332-1336.  Thermal management of Bridgelux Micro SM4 series LEDs. http://www.bridgelux.com.  X.C. Tong, Development and application of advanced thermal management materials, Advanced materials for thermal management of electronic packaging Springer series in advanced microelectronics 30 (2011) 527-593. http://link.springer.com.ap.lib.nchu.edu.tw:2048/content/pdf/10.1007%2F978-1-4419-7759-5_12.pdf.  LUXEON LED Thermal measurement guidelines. http://www.philipslumileds.com.  Thermal management of OSRAM OSTAR projection light source. http://www.osram-os.com.  B. Ozmat , B. Leyda, B. Benson, Thermal applications of open-cell metal foams, Mater. Manuf. Processes 19 (2004) 839-862.  A. Kopanidis, A. Theodorakakos, E. Gavaises, D. Bouris, 3D numerical simulation of flow and conjugate heat transfer through a pore scale model of high porosity open cell metal foam, Int. J. Heat Mass Transfer 53 (2010) 2539–2550.  施威宏, 多孔性電子散熱器衝擊流流場及熱傳研究, 博士論文, 國立中正大學機械工程學系，民國96年6月。  M.S. Phanikumar, R.L. Mahajan, Non-Darcy natural convection in high porosity metal foams, Int. J. Heat Mass Transfer 45(2002) 3781–3793.  M.F. Ashby, A. Evans, N.A. Fleck, L.J. Gibson, J.W. Hutchinson, H.N.G. Wadley, Metal Foam. A Design Guide, Chapter 13, Butterworth Heinmann, Woburn, MA, USA, 2000.  A. Ejlali, A. Ejlali, K. Hooman, H. Gurgenci, Application of high porosity metal foams as air-cooled heat exchangers to high heat load removal systems, Int. Commun. Heat Mass Transfer 36 (2009) 674–679.  S. Mancin, C. Zilio, A. Diani, L. Rossetto, Experimental air heat transfer and pressure drop through copper foams, Exp. Therm. Fluid Sci. 36 (2012) 224-232.  C.Y. Zhao, T.J. Lu, H.P. Hodson, J.D. Jackson, The temperature dependence of effective thermal conductivity of open-celled steel alloy foams, Mater. Sci. Eng.: A 367 (2004) 123–131.  V.V. Calmidi, R.L. Mahajan, Forced convection in high porosity metal foams, J. Heat Transfer 122 (2000) 557–565.  S. Mahjoob, K. Vafai, A synthesis of fluid and thermal transport models for metal foam heat exchangers, Int. J. Heat Mass Transfer 51 (2008) 3701–3711.  R.Y. Chein, H.H. Yang, T.H. Tsai, C.J. Lu, Experimental study of heat sink performance using copper foams fabricated by electroforming, Microsyst Technol 16 (2010) 1157–1164.  P. M. Kamath, C. Balaji, S.P. Venkateshan, Experimental investigation of flow assisted mixed convection in high porosity foams in vertical channels, Int. J. Heat Mass Transfer 54 (2011) 5231–5241.  J.J. Kuang, T. Kim, M.L. Xu, T.J. Lu, Ultralightweight compact heat sinks with metal foams under axial fan flow impingement, Heat Transfer Eng. 33 (2012) 642–650.  M. Maaspuro, A. Tuominen, Thermal analysis of LED spot lighting device operating in external natural or forced heat convection, Microelectron. Reliab. 53 (2013) 428–434.  A. Christensen, S. Graham, Thermal effects in packaging high power light emitting diode arrays, Appl. Therm. Eng. 29 (2009) 364–371.  Z.G. Xu, Z.G. Qu, C.Y. Zhao, Experimental study of natural convection in horizontally-positioned open-celled metal foams, ICMREE 1 (2011) 923–928.  SMD LED datasheet. http://www.everlight.com.  SMD LED Technical datasheet. http://www.wellypower.com.  Cree XLamp XR-E LED, Product family datasheet. http://www.cree.com.  Osram Ostar - Lighting plus datasheet. http://www.osram-os.com.  Luxeon Rebel datasheet. http://www.philipslumileds.com.  C. Y. Zhao, T. Kim, T.J. Lu, H. P. Hodson, Thermal transport phenomena in porvair. Metal foams and sintered beds, Final report, Micromechanics Centre & Whittle Lab., Department of Engineering, University of Cambridge, Cambridge, U.K., 2001.  A. Kopanidis, A. Theodorakakos, E. Gavaises, D. Bouris, 3D numerical simulation of flow and conjugate heat transfer through a pore scale model of high porosity open cell metal foam, Int. J. Heat. Mass Transfer 53(2010) 2539–2550.  Jessica J. Bock, A geometric study of liquid retention in open-cell metal foams, Thesis, Science in mechanical engineering, University of Illinois at Urbana-Champaign, USA, 2011.  P. M. Kamath, C. Balaji, S.P. Venkateshan, Convection heat transfer from aluminium and copper foams in a vertical channel - An experimental study, Int. J. Therm. Sci. 64 (2013) 1-10.  T. B. Hoberg, K. Muramatsu, E. M. Cherry, J. K. Eaton, Thermal dispersion in metal foams, ASME/JSME 8th Therm. Eng. Jt. Conf., JTEC 2011.  D. A. Nield, A. Bejan, Convection in porous media, New York: 3rd Edition, Springer, 2006. http://link.springer.com.ap.lib.nchu.edu.tw:2048/content/pdf/bfm%3A978-0-387-33431-8%2F1.pdf.  COMSOL MULTIPHYSICS, Coupled flow laws, solved with COMSOL MULTIPHYSICS. http://www.comsol.com.  COMSOL MULTIPHYSICS, Modeling guide. http://www.comsol.com.||摘要:||
LED照明可以節能，已成為照明主流。為保證LED的功能與可靠度，照明產品必須具備良好的散熱系統。發泡金屬散熱器散熱之優勢包括其具有大的比表面積、體積小、重量輕、高孔隙率和複雜的三維立方網狀結構使其具有熱傳強化的功能且易於加工等。本研究設計製備4種孔密度(PPI)開孔型發泡銅及實心紅銅之散熱器配置風扇，與LED陣列組裝成LED崁燈，探討在自然對流及強制對流之下，發泡金屬作為散熱器之功能，並與傳統鰭片式散熱器比較。以數值模擬溫度分佈並進行實驗，並以實驗驗證其正確性。實驗結果本研究之發泡銅與傳統鰭片式散熱器之體積比僅為0.14，重量比僅為0.29 ~ 0.30，發泡銅散熱器在自然對流下其散熱功能相當接近傳統鰭片式散熱器；在強制對流下，更發揮其散熱優勢而顯示出優異散熱功能。實驗之各種發泡銅散熱器之熱阻遠低於容許值以下，且以其組裝之LED崁燈，LED接面溫度遠低於容許值而可維持崁燈極佳之可靠度。總體而言，以發泡銅作為散熱材料，相對而言相當成功。
LED lighting has become one of the mainstreams in the future development of lighting. As the lighting power continues to grow, advanced cooling is required to ensure LED functionality and reliability. In this study, heat sink made by copper foam was employed as heat sink for the LED heat dissipation and its performance was compared with the conventional heat sink. The volume and weight of the copper foam were 0.14 and 0.29 ~ 0.3 times of the conventional die casting made aluminum heat sink, respectively. The solid copper with equal volume of copper foam was also employed as the heat sink and its performance was used as comparison reference.
Both experimental measurement and numerical modeling were carried out in this study. In the experiment, copper foams with four different pores per inch (PPI) were tested under the same conditions. For natural convection case, it was found that the thermal resistance of the copper foam was comparable with those of solid copper and conventional heat sinks. For the forced convection case with fan included, lower thermal resistance can be achieved by the copper foam heat sinks due to its special porous structure. For the numerical modeling using multi-physics code COMSOL, agreement between the predicted and measured temperature distributions can be obtained for the solid copper heat sink case. Numerical model using copper foam as heat sink will be developed in the future.
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