Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/2911
標題: 薄型TFT-LCD面板切割製程之研究
Study On Thin TFT-LCD Substrate Scribing Process.
作者: 劉佳欣
Liu, Jia-Hsin
關鍵字: 切割;cutting;刀輪;薄化玻璃;垂直裂深;wheel;thin TFT-LCD;vertical crack
出版社: 機械工程學系所
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摘要: 
考量改善薄化TFT-LCD切割製程良率,本研究的目的在於找出適合薄化玻璃切割之製程條件,使之達到良好的垂直裂深及切割品質。實驗使用的切割機為日本三星MDI出產之MPX系列,實驗的玻璃材質為ASAHI AN100,厚度為0.5mm,針對切割條件,以切割壓力、切割速度、切割刀輪角度及刀輪齒數為實驗變因,利用假設檢定證明上述四項皆為影響垂直裂深之重要因子,並將其條件及垂直裂深深度值執行迴歸,得到垂直裂深相對於實驗條件之經驗方程式,藉此方程式的產生,即可估算出變更條件後之垂直裂深。實驗結果顯示,薄化玻璃較佳的切割壓力範圍座落在8N~9.5N之間,以MPX機型切割玻璃所得之中央裂紋深度,約為Tanaka推導出之深度的0.25倍,以250 mm/s~300 mm/s之切割速度較適合ASAHI AN100薄化玻璃切割,另外,避免刀輪的角度及齒數對於薄化玻璃切割產生影響,建議以110度140齒之刀輪進行ASAHI AN100 薄化玻璃切割。

This study intends to identify appropriate conditions to cut thin TFT-LCD to improve the production. The MPX cutting machines, from MDI company, is adopted in the experiment. The material of glass which is as thin as 0.5mm is ASAHI AN100. The variables of experiment are cutting pressure, cutting speed, angles of wheel, the number of teeth in cutting wheel. These variables are proved to be important factors to affect the length of vertical crack by hypotheses test. Furthermore, an empirical equation to relate the experiment variables and length of vertical crack is generated by it. This equation is able to estimate the length of vertical crack in alternative conditions. The result reveals that the value of better cutting pressure is from 8.5N to 9.0N. The median length of vertical crack is approximately one-fourth of the value conducted by Tanaka. The better cutting speed is from 250mm/s to 300mm/s. It’s recommended that angles of wheel and the number of teeth in wheel are 110° and 140 number.
URI: http://hdl.handle.net/11455/2911
其他識別: U0005-1408201210062200
Appears in Collections:機械工程學系所

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