Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/2917
標題: 超音波輔助切削於鋯鈦酸鉛(PZT)薄膜加工應用之研究
Study of ultrasonic assisted cutting for PZT thin film machining.
作者: 蘇孟慧
Su, Meng-Hui
關鍵字: 超音波輔助鑽削;ultrasonic assisted drilling;超音波輔助銑削;PZT;切削力訊號;ultrasonic assisted milling;PZT thin film
出版社: 機械工程學系所
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摘要: 
隨著科技進步以及工具機不斷的發展,壓電材料的應用越來越廣泛,多以蝕刻方式進行加工,缺點包含效率低、圖案化不易及加工成本高,因此需發展易於半導體製程且高效率的加工方式,一般機械加工擁有加工較有彈性之優點,但易造成加工後的表面產生裂紋與凹坑現象,如利用超音波輔助振動的特性可達成對硬脆材料進行延性切削加工之目的並改善刀具快速磨耗的問題。
本研究以超音波輔助銑削與鑽削方式進行實驗,並分析超音波振動在銑削與鑽削加工中對加工表面品質的影響;實驗於精密三軸綜合加工機上進行,加工晶片則安裝於超音波換能器之上以提供加工中所需之超音波振動,另外安裝微型動力計於換能器之下,以量測加工中之切削力,切削完成後之表面形貌則以白光干涉儀與顯微鏡觀察加工之品質,切屑則於收集後以SEM觀察其形貌。
實驗結果顯示,超音波輔助銑削與鑽削可改善PZT薄膜/矽晶圓加工表面與孔洞品質;在銑削過程中,超音波輔助振動可提升臨界進給;在鑽削時,可降低切屑堵塞的問題。在刀具磨耗改善方面,超音波輔助加工比一般加工後的刀具磨耗量減少至1/2倍,也可改善其鍍膜脫離的現象。

The PZT thin film draws much more attention in developing the MEMS device. However, the efficiency of pattern generation by etching process limits its range of applications. To improve the flexibility and efficiency in the manufacturing of PZT thin film based device, micro metal cutting process provides a potential solution if the ductile mode cutting can be achieved during manufacturing. In this study, the performance of the ultrasonic assisted micro cutting along with CVD diamond coated micro tool was investigated in micro milling and drilling of PZT thin film deposited wafer. The experiments were conducted on a three-axis high precision machine tool. During machining, the wafer was clamped on a Z direction ultrasonic vibrator and the cutting force was measured by a Kistler dynamometer installed under the ultrasonic vibrator. After performing machining, the chip was collected and investigated by SEM. The profile and surface roughness of the finished surface were investigated by a microscope and a white light interferometer as well.
The results show that the fracture on machined surface in the micro milling and drilling of PZT/Si wafer can be reduced by adding the ultrasonic vibration to the system. In micro drilling of PZE/SI wafer, the chip clogging and the surface fracture can be reduced. Moreover, the tool wear can also be reduced if the ultrasonic vibration assisted machining was conducted.
URI: http://hdl.handle.net/11455/2917
其他識別: U0005-2708201312203300
Appears in Collections:機械工程學系所

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