Please use this identifier to cite or link to this item:
標題: 超音波輔助切削於鋯鈦酸鉛(PZT)薄膜加工應用之研究
Study of ultrasonic assisted cutting for PZT thin film machining.
作者: 蘇孟慧
Su, Meng-Hui
關鍵字: 超音波輔助鑽削;ultrasonic assisted drilling;超音波輔助銑削;PZT;切削力訊號;ultrasonic assisted milling;PZT thin film
出版社: 機械工程學系所
引用: [1]C. Y. Zhao, X. Li and F. Jiao, “Research on Crack Mechanism of Surface/Subsurface Based on Grinding Stress Field in Ultrasonic Grinding Nano-Ceramics,” Applied Mechanics and Materials, Vol. 42, 2010, pp.444-448 [2]M. Zhou, B.K.A. Ngoi, Z.W. Zhong and C. S. Chin, ” Brittle-ductile Transition in Diamond Cutting of Silicon Single Crystals,” Materials and Manufacturing Processes, Vol. 16, 2012, pp.447-460 [3]R. Komanduri, D. A. Lucca, and Y. Tani, “Technological Advances in Fine Abrasive Processes,” Annals of the CIRP, Vol. 46, 1997, pp.545–596. [4]M. B. Cai, X. P. Li, M. Rahman, “Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamic simulation,” International Journal of Machine Tools & Manufacture, Vol. 47, 2007, pp.75–80. [5]Z. J. Pei, P. M. Ferreira, S. G. Kapoor , M. Haselkorn, ”Rotary ultrasonic dilling and milling of ceramics,” Journal of Machine Tools and Manufacture, Vol.36, 1995, pp.1033-1046 [6]J.P. Kang, “A study on ultrasonic vibration cutting of fine ceramics,” Ph.D. Thesis, Pusan National University, 1993. [7]J. Kumabe, K. Fuchizawa, T. Soutome, Y. Nishimoto, ”Ultrasonic superposition vibration cutting of ceramics,” Precision Engineering, Vol. 11, 1989, pp.71-77 [8]J. Kumabe, “Fundamentals and Application of Vibration Cutting,” Jikkyou Publishing Company, 1979. [9]X. H. Shen , J. Zhang , D. X. Xing ,Y. Zhao, “A study of surface roughness variation in ultrasonic,” International Journal of Advanced Manufacturing Technology, 2012, pp 553-561 [10]M. Arif, M. Rahman, W. Y. San , “Ultraprecision ductile mode machining of glass by micromilling process,” Journal of Manufacturing Processes, 2011, pp 50-59 [11]M. Arif , M. Rahman ,W. Y. San, “An experimental study on the machining characteristics in ductile-mode milling of BK-7 glass,” International Journal of Advanced Manufacturing Technology, 2012, pp. 487-495 [12]M. R. Razfar, P. Sarvi, M. A. Zarchi, ” Experimental investigation of the surface roughness in ultrasonic-assisted milling,” Proc. IMechE, Vol. 225, 2011,pp.1616-1620 [13]T. Tawakoli, B. Azarhoushang, M. Rabiey, ” Ultrasonic assisted dry grinding of 42CrMo4,” International Journal of Advanced Manufacturing Technology, Vol. 42, 2009, pp 883-891 [14]G.F. Gao, B. Zhao, D.H. Xiang, Q.H. Kong, ”Research on the surface characteristics in ultrasonic grinding nano-zirconia ceramics,” Journal of materials processing technology, vol.209, 2008, pp.32-37 [15]B. Zhao, C. Zhao, B. Du, ”Experimental Study on Damage Mechanism of Nano-Ceramic Surface/Subsurface under Ultrasonic Vibration Aided Grinding,” Solid State Phenomena,Vol. 175, 2011, pp 107-111 [16]W. Horst, H. Juergen, P. Rolf, “Turning of machinable glass ceramics with an ultrasonically vibration tool,” Vol. 33, 1984, pp.85-87 [17]J. Gan, X. Wang, M. Zhou, B. Ngoi, Z. Zhong, ”Ultraprecision Diamond Turning of Glass with Ultrasonic Vibration,” CIRP Annals, Vol. 21, 2003, pp.952-955 [18]C. Zhang, D. Zhang, X. Ma, “effects of ultrasonic vibration on machining accuracy in micro drilling,” Advanced Materials Research, Vol. 102-104, 2010, pp. 521-524 [19]H. Onikura, A. katsuki , ”Vibration Characteristics of Drill with reference to effects of main cutting edges,” A chisel Edge and aargins, Vol.54, 1998, pp.1691-1696 [20]K. Egashira, K. Mizutani, T. Nagao, “Ultrasonic Vibration Drilling of Microholes in Glass,” CIRP Annals - Manufacturing Technology, Vol. 51, 2002, pp. 339-342 [21]K. I. Ishikawa, H. Suwabei, T. Nishide, M. Uneda, “Study on combined vibration drilling by ultrasonic and low-frequency vibrations for hard and brittle materials,” Precision Engineering,Vol.22 , 1998, pp.196-205 [22]Y. S. Liao, Y. C. Chen, H. M. Lin, “Feasibility study of the ultrasonic vibration assisted drilling of Inconel superalloy,” International Journal of Machine Tools and Manufacture, Vol. 47, 2007, pp.1988-1996. [23]F. Jiao and B. Zhao ,“Influence of Ultrasonic Assistance on Material Removal Mechanism of Hard and Brittle Materials Based on Single-point Scratch, ” Applied Mechanics and Materials, Vol. 487, 2011, pp.413-418 [24]E. Shamoto, T. Moriwaki, “Study on elliptical vibration cutting, ” CIRP Annals - Manufacturing Technology, Vol. 43, 1994, pp.35-38 [25]E. Shamoto, T. Moriwaki, S. Y. Chan, K. Seido, “Development of a Elliptical Vibration Milling Machine,” CIRP Annals - Manufacturing Technology, Vol. 53, 2004, pp.341-344 [26]C. Nath, M. Rahman, K.S. Neo, “A study on ultrasonic elliptical vibration cutting of tungsten carbide,” Journal of Materials Processing Technology, Vol. 209, 2009, pp. 4459-4464 [27]E. Shamoto, S. Norikazu, ”Elliptical Vibration Cutting of Hard Mold Materials,” 2008. [28]J. S. Lee, D. W. Lee, H.Y. Jung, W. S. Chung, “A study on micro-grooving characteristics of planar lightwave circuit and glass using ultrasonic vibration cutting,” Journal of Materials Processing Technology, Vol. 130-131 ,2002 ,pp.396-400 [29]Y. Peng, Y. B. Wu, Z. Q. Liang, Y. B. Guo, X. Lin, “An experimental study of ultrasonic vibration-assisted grinding of polysilicon using two-dimensional vertical workpiece vibration,” International Journal of Advanced Manufacturing Technology, Vol. 54 ,2011, pp. 941-947 [30]李正中,1999,薄膜光學與鍍膜技術,藝軒圖書出版社。 [31]安永暢男,高木純一郎,2004,精密機械加工原理,全華圖書 [32]J. Yan , T. Asami, H. Harada, T. Kuriyagawa, “Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining,” Precision Engineering, Vol. 33, 2009, pp.378-386, . [33]柯晟斌,2005,振動高速銑削應用於鍍層刀具加工之研究,國立雲林科技大學機械工程系碩士班碩士論文 [34]D.E. Brehl , T.A. Dow, “Review of vibration-assisted machining ,” Precision Engineering ,Vol. 32, 2008, pp.153–172. [35]林維新,紀松水,1987,切削理論,全華圖書 [36]A. Aramcharoen, P. T. Mativenga, ”Size effect and tool geometry in micromilling of tool steel,” Precision Engineering, Vol. 32, 2009, pp. 402-407.

The PZT thin film draws much more attention in developing the MEMS device. However, the efficiency of pattern generation by etching process limits its range of applications. To improve the flexibility and efficiency in the manufacturing of PZT thin film based device, micro metal cutting process provides a potential solution if the ductile mode cutting can be achieved during manufacturing. In this study, the performance of the ultrasonic assisted micro cutting along with CVD diamond coated micro tool was investigated in micro milling and drilling of PZT thin film deposited wafer. The experiments were conducted on a three-axis high precision machine tool. During machining, the wafer was clamped on a Z direction ultrasonic vibrator and the cutting force was measured by a Kistler dynamometer installed under the ultrasonic vibrator. After performing machining, the chip was collected and investigated by SEM. The profile and surface roughness of the finished surface were investigated by a microscope and a white light interferometer as well.
The results show that the fracture on machined surface in the micro milling and drilling of PZT/Si wafer can be reduced by adding the ultrasonic vibration to the system. In micro drilling of PZE/SI wafer, the chip clogging and the surface fracture can be reduced. Moreover, the tool wear can also be reduced if the ultrasonic vibration assisted machining was conducted.
其他識別: U0005-2708201312203300
Appears in Collections:機械工程學系所

Show full item record

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.