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Research for the Effects of Copper Wire Bonding Process on Coverage of Intermetallic Compounds
|關鍵字:||銅線;Cu wire;介金屬;介金屬覆蓋;銲線參數;IMC;IMC Coverage;Wire Bonding Parameter||出版社:||機械工程學系所||引用:|| 呂宗興，“電子構裝技術的發展歷程”，工業材料，Vol. 115，1996。  J. Hirota, K. Machida, T. Okuda, M. Shimotomai, and R. Kawanaka, “The Development of Copper Wire Bonding for Plastic Molded Semiconductor Packages,” Proceedings of the 35th Electronic Components Conference, Washington, D.C., May 20–22, pp. 116–121, 1985.  J. Kurtz, D. Cousens, and M. Dufour, “Copper Wire Ball Bonding,” Proceedings of the 34th Electronic Components Conference, New Orleans, Louisiana, May 14–16, pp. 1–5, 1984.  K. Atsumi, T. Ando, M. Kobayashi, and O. Usuda, “Ball Bonding Technique for Copper Wire,” Proceedings of the 36th Electronic Components Conference, Washington, May 5–7, pp. 312–317, 1986.  L. Levine and M. Shaeffer, “Copper Ball Bonding,” Semiconductor International, Aug., pp. 126–129, 1986.  J. Onuki, M. Koizumi, and I. 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Kao. ”Growth of CuAl Intermetallic Compounds in Cu and Cu(Pd) Wire Bonding,” Proceedings of the 61th Electronic Component and Technology Conference (ECTC2011), May 31 – June 3, Lake Buena Vista, FL, USA, pp. 1481-1488, 2011.  T. Uno, “Bond Reliability under Humid Environment for Coated Copper Wire and Bare Copper Wire,” Microelectronics Reliability, Vol. 51, No. 1, pp. 148-156, 2011.  http://www.kns.com/en-us/Pages/Home.aspx  ASTM International, Test Method For Destructive Shear Testing Of Ball Bonds, ASTM F1269-89(1995)e1, American Society for Testing of Materials, 1995.||摘要:||
最後觀察其信賴性影響，當第一銲點參數設定摩擦開啟時，與選用粗糙面銲針，因改善了介金屬覆蓋率與覆蓋面積，代表銅球與鋁墊能確實接和，所以在信賴性的失效的結果有效提升其壽命(由HAST 96hrs提升至HAST 244hrs)。
In this thesis, we are focusing on the coverage rate and area of the inter-metallic compounds (IMC) during copper wire bonding process, effect by the setting of the scrub on/off mode in 1st bond process and the surface quality of the capillary. Also, other required bonding process qualities are being analyzed. Finally, reliability test is being conducted to verify the improvement of the failure rate due to poor inter-metallic compounds.
From the experimental results, it is found that as the 1st bond parameter is setting at the scrub on mode, a better IMC coverage rate and area can be expected. The IMC area increases 10%. A uniform aluminum splash along X and Y direction is found with the splash decreases 2%. And the average copper ball pulling force increase 1 g. When a rough surface capillary is selected, the IMC coverage rate and area have increased 10% and 6% respectively. While the average copper ball pulling force has increased 2 g. In both setting, a flat copper ball bottom is achieved.
Finally, due to the improvement of IMC coverage rate and area, the copper ball and aluminum pad can bond tight and hence reduce failure rate on the reliability test (the HAST results is increased from 96 hours to 244 hours).
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