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標題: 電子斑點干涉術、剪像術、熱影像術檢測複合材料缺陷之比較
The comparison of inspections of CFRP material defect with Electronic Speckle Pattern Interferometry, Shearography, and Thermography techniques
作者: 徐永俊
Hsu, Yung-Chum
關鍵字: 電子斑點干涉術;Electronic Speckle Pattern Interferometry;剪像術;電子斑點剪像干涉術;紅外線熱影像;缺陷檢測;Shearography;electronic speckle pattern shearing interferometry;infrared Thermography;inspect defects
出版社: 機械工程學系所
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本研究透過功率500W鹵素燈對碳纖維複合材料(CFRP)試片背面進行加熱來探討電子斑點干涉術(ESPI)、電子斑點剪像干涉術(ESPSI)和熱影像術三種方法檢測缺陷能力之比較。實驗結果顯示三種方法都可以檢測到表層缺陷,但熱影像術較ESPI與ESPSI需要更多的熱量才能產生足夠的溫度梯度讓紅外線攝影機顯現材料的缺陷。此外,熱影像術需調整不同溫度刻度的假色彩(pseudo color)讓缺陷區域更容易被檢測出來,但此過程相當耗時。不幸的,在此加熱熱源和拘束的條件下,三種方法皆無法看到檢測試片的深層缺陷。

This study utilizes electronic speckle pattern interferometry (ESPI), electronic speckle pattern shearing interferometry (ESPSI), and thermography techniques by the back-heating of 500W Halogen lamp on carbon-fiber-reinforced-polymer (CFRP) material to explore their defect-detecting capacities. Experimental data shows that near-surface defects can be detected by all the three techniques, but compared to the ESPI and ESPSI method, the thermography method needs more heating energy to generate sufficient temperature gradient for successful infrared imaging of material flaws. Additionally, the thermography technique needs to tune the pseudo color for different temperature scale to make the defect area more visible for detecting and the process is time-consuming. Unfortunately, none of the three methods can detect deeper-surface flaws under the heating and constrain conditions of our testing samples.
其他識別: U0005-2108201317411100
Appears in Collections:機械工程學系所

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