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The comparison of inspections of CFRP material defect with Electronic Speckle Pattern Interferometry, Shearography, and Thermography techniques
|關鍵字:||電子斑點干涉術;Electronic Speckle Pattern Interferometry;剪像術;電子斑點剪像干涉術;紅外線熱影像;缺陷檢測;Shearography;electronic speckle pattern shearing interferometry;infrared Thermography;inspect defects||出版社:||機械工程學系所||引用:||參考文獻  E. Grinzato,V. A. M Luprano, S. Marinetti, P. G. Bison, R. Trentin, Thermal NdE of FRP applied to civil structures, CNR-ITC c.so Stati uniti,4-35127 Padua, Italy, 2005.  W. Swiderski, D. Szabra, M. Szudrowicz, Nondestructive Test of composite armours by using IR thermographic method, 9th international Conference on Quantitative Infrared Thermography. July 2-5, Krakow-Poland , 2008.  劉慶堂,熱影像檢測技術應用於複合材料結構缺陷之探 討,國立中興大學機械工程系博士論文,2012.  D. Gabor ,Microscopy by Reconstructed Wave-Fronts, Proc. Roy.Soc.A197, 1949, pp.454-487.  D. Gabor ,Microscopy by Reconstructed Wave-Fronts II, Proc. Roy.Soc.B64, 1951, pp.449-469.  R. Jones and C. Wykes ,Holographic and Speckle Interferometry, Cambridge , UK, 1983.  A. J. Moor and J. R. Tyrer ,Phase-stepped ESPI and moir interferometry for measuring the stress-intensity factor and Jintergral, Exp. Mech. , Vol.35, 1995, pp.306-314.  H. H. Hopkins and H. J. Tizinani ,Speckling in diffraction patterns and optical images formed with the laser, Proc. Int. Symp. Hologr, Besancon, 1970.  W. Steinchen, L. X. Yang , M Schuth and G. Kupfer , Precision measurement and nondestructive testing by means of digital phase shifting speckle pattern and speckle shearing interferometry , Measurement , Vol. 16, 1995, pp. 149-160.  Y. Y. Hung,Digital Shearography versus TV-holography for Non-destructive Evaluation, Optics and Lasers in Engineering, Vol.26, 1997,pp.421-436.  Y. Y. Hung , J. Q. Wang and J. D. Hovanesian ,Technique for Compensating Excessive Rigid Body Motion in Nondestructive Testing of Large Structures Using Shearography , Optics and Lasers in Engineering, Vol. 26, 1997, pp. 249-258.  R. B. Hathaway,J. D. Hovanesian and M. Y. Hung, Residual Stress Evaluation using Shearography with Large-Shear Displacements , Optics and Lasers in Engineering, Vol. 27, 1997, pp.43-60.  S. Dilhaire, S. Jorez, A. Cornet, L. D. Patino Lopez and W. Claeys , Measurement of themo-mechanical strain of electronic devices by shearography ,Microelectronics Reliability, Vol.40, 2000, pp.1509-1514.  Bernhard Lau , Thorsten Kronthaler and Ralf Schilling, A micro – prism array as shearing device for speckle shearing interferometry , Optics and Lasers in Engineering, Vol.36, 2001, pp.389-396.  Kyung-Suk Kim,Ki-Soo Kang,Young-June Kang and Seong-Kyun Cheong,Analysis of an internal crack of pressure pipeline using ESPI and shearography , Optics and Lasers in Engineering, Vol. 35, 2003, pp.635-643.  D. J. Roth, J. R. Bodis and C. Bishop,Thermographic Imaging for High-Temperature Composite Materials-A Defect Detection Study ,Physics and Astronomy, Vol. 9,Number 3, 1997, pp.147-169.  V. P. Vavilov,Pulsed thermal NDT of material： back to the basics ,Nondestructive Testing and Evaluation, Vol. 22, Nos.2-3, 2007, pp.177-197.  A. A. Badghaish and D. C. Fleming,Quantitative characterization of resistive defects in thick composites using step heating thermography, Proc. Of SPIE, Vol.6939, 2008, pp. 693916-693916-12.  Liu-Sheng Wang, K Jambunathan, Brian N. Dobbins, Shi-Ping He, Measurement of three-dimensional surface shape and deformations using phase stepping speckle interferometry,Optical Engineering, Vol. 35, No. 8, 1996, pp. 693916-693916-12.  J. N. Butters, and J. A. Leendertz, Holographic and Video Techniques Applied to Engineering Measurement, Journal of Measurement and Control, Vol.4, 1971, pp.349-354.||摘要:||
This study utilizes electronic speckle pattern interferometry (ESPI), electronic speckle pattern shearing interferometry (ESPSI), and thermography techniques by the back-heating of 500W Halogen lamp on carbon-fiber-reinforced-polymer (CFRP) material to explore their defect-detecting capacities. Experimental data shows that near-surface defects can be detected by all the three techniques, but compared to the ESPI and ESPSI method, the thermography method needs more heating energy to generate sufficient temperature gradient for successful infrared imaging of material flaws. Additionally, the thermography technique needs to tune the pseudo color for different temperature scale to make the defect area more visible for detecting and the process is time-consuming. Unfortunately, none of the three methods can detect deeper-surface flaws under the heating and constrain conditions of our testing samples.
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