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標題: 藍光覆晶發光二極體應用於晶圓級封裝之探討
Applications of InGaN base Flip-Chip on Wafer Level Chip Package
作者: 江昌翰
Chiang, Chang-Han
關鍵字: 晶圓級封裝;WLCSP;覆晶發光二極體;反射鏡;Flip-Chip;Reflector
出版社: 光電工程研究所
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覆晶發光二極體結構中反射結構(Reflector)與晶粒保護層(Passivation) 會直接影響晶粒亮度與可靠度,因此針對其結構中反射鏡效率與晶粒保護層材料的選擇進行實驗設計。反射結夠優化實驗中,以不同厚度的氧化銦錫(ITO)與氧化矽(SiO2)再搭配鋁金屬反射鏡所得到的最佳反射率為82%。

This research aimed at Flip-chip structure study to improve the heat dissipation problem that occurred in traditional wire bonding chip and also compare with chip characteristic and heat dissipation ability between these two different chip structures.
In Flip-chip structure reflector and passivation will influence the light intensity and chip reliability. Using different thickness in ITO and SiO2 with aluminum reflector in reflector experiment, the optimum reflection obtaining is around 82%. In passivation experiment, using silicon oxide, silicon nitride and aluminum oxide, the aluminum oxide revealed the best result in reliability test. Applied the optimum experiments parameters in this research to fabricate Flip-Chip, he obtained output power in Flip-Chip is higher, junction temperature is lower and intensity decay is smaller than transitional wire bonding chip.
其他識別: U0005-1908201319462900
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