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標題: 高鉍合金與不同金屬基材之界面反應
Interfacial Reactions Between High-Bi Alloys and Various Metallic Substrates
作者: 王錦翊
Wang, Jin-Yi
關鍵字: 無鉛銲料;Lead-free solder;電子封裝;electron packaging
出版社: 化學工程學系所
引用: [1] 陳信文、陳立軒、林永森、陳志銘, "電子構裝技術與材料"高立圖書, (2006). [2] N. Lee, "Lead-free Soldering-Where the World is going", Advancing Microelectronics . Vol. 26 (5), pp. 29-36 (1999). [3] M. Abtew, "Lead-free Solder in Microelectronics", Mater. Science and Engineering, Vol. 27, pp. 95-141 (2000). [4] J. Lau, "Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies"McGraw-Hill, (2000). [5] 白蓉生, "無鉛焊接的到來與因應". pp. 5-27, 電路板會刊, (2003). [6] J. Glazer, "Metallurgy of low temperature Pn-free solders for electronic assembly", International Materials Reviews, Vol. 40 (2), pp. 65-93 (1995). [7] W. Plumbridge, "Solder in electronics ", J. Mater. Science, Vol. 31 (10), pp. 2501-2514 (1996). [8] P. Vianco, "Solder Alloys: A Look at the Past, Present and Future", J. Welding Vol. 76 (3), pp. 45-49 (1997); N. Lee, "Getting Ready for Lead-free Solder ", Soldering and Surface Mount Tech. , Vol. 9 (2), pp. 66 (1997). [9] B. Trumble, "Get the lead out! [lead free solder]", IEEE spectrum, Vol. 35 (5), pp. 55-60 (1998). [10] K. L. Erickson, "Modeling the solid-state reaction between Sn-Pb solder and porous substrate coating", J. Electron. Mater., Vol. 27 (11), pp. 1177-1192 (1998). [11] J. Lalena, N. Dean, and M. Weiser, "Experimental Investigation of Ge-Doped Bi-11Ag as a New Pb-Free Solder Alloy for Power Die Attachment", J.Electron. Mater., Vol. 31, pp. 1244-1249 (2002). [12] M. Rettenmayr, "High Melting Pb-Free SolderAlloys for Die-Attach Applications", Adv. Eng. Mater., Vol. 7, pp. 965-969 (2005). [13] S. Anhock, H. Oppermann, C. Kallmayer, and H. Reichl, "Manufacturing Technol. Symp. Proc", IEEE, (1998). [14] J. Song, H. Chuang, and Z. Wu, "Interfacial Reactions between Bi-Ag High-Temperature Solders and Metallic Substrates", J. Electron. Mater., Vol. 35, pp. 1041-1049 (2006). [15] J. Tsai, C. Chang, and C. Kao, "Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates", J. Electron. Mater., Vol. 35, pp. 65-71 (2006). [16] J. Song, H. Chuang, and Z. Wu, "Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications", J. Electron. Mater., Vol. 36, pp. 1516-1523 (2008). [17] I. OHNUMA, "Development of Bi Base High Temperature Pb Free Solders with Second Phase Dispersion Thermodynamic Calculation, Microstructure, and Interfacial Reaction", J. Electron. Mater., Vol. 35, pp. 1926-1932 (2006). [18] J. Wang and C. M. Chen, "Retarding the Cu5Zn8 phase fracture at the Sn-9wt.% Zn/Cu interface", Sc.r Mater., Vol. 64 (7), pp. 633-636 (2011). [19] S. Kim, K. Kim, and K. Suganuma, "Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders", J. Electron. Mater., Vol. 38, pp. 266-272 (2008). [20] S. Kim, K. Kim, and K. Suganuma, "Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier", J. Electron. Mater., pp. 266-272 (2009). [21] J. Lee, K. Kim, K. Suganuma, J. Takenaka, and K. Haigio, "Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate", Mater. Trans., Vol. 46, pp. 2413-2418 (2005). [22] T. Massalski, H. Okamoto, P. Subramanian, and L. Kacprzak, "Binary Alloy Phase Diagram : Au-Sn". pp. 434, ASM International, (1990). [23] J. Kim, S. Jeong, and H. Lee, "Thermodynamics Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications", Mater. Trans, Vol. 43, pp. 1873-1878 (2002). [24] J. Yoon, H. Chun, and S. Jung, "Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating", J. Mater. Res, Vol. 22, pp. 1219-1229 ( 2007). [25] J. Tsai, C. Chang, Y. Shieh, Y . Hu, and C. Kao, "Controlling the Microstructure from the Gold-Tin Reaction", J. Electron. Mater., Vol. 34, pp. 182-187 (2005). [26] H. Chung , C. Chen, C. Lin, and C. Chen, "Microstructural evolution of the Au–20wt.% Sn solder on the Cu substrate during reflow", J Alloys Compd, Vol. 485 (1–2), pp. 219-224 (2009). [27] Z. Kivilahti, "Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems", J. Electron. Mater., Vol. 30 (1), pp. 35-44 (2001). [28] T. Massalski, H. Okamoto, P. Subramanian, and L. Kacprzak, "Binary Alloys Phase Diagrams: Ni-Sn". pp. 2864, ASM International, (1997). [29] T. Massalski, H. Okamoto, P. Subramanian, and L. Kacprzak, "Binary Alloys Phase Diagrams: Ni-Bi". pp. 769, ASM International, (1990). [30] Yen, unpublished work (2012).
生成,並發現Cu3Sn 與銅基材產生脫離的現象,富鉍相(Bi-rich)存在
於Cu3Sn 與銅基材間,對此現象我們使用三元相圖解釋,並提出了合
Cu3Sn 會隨著熱處理時間增加而增厚,並且部分的Cu3Sn 會轉變成
Cu6Sn5。Bi-2wt.%Sn/銀/銅系統中,迴焊反應在15 秒時,Cu3Sn 已經
與基材脫離, 且銀鍍層溶入合金與介金屬化合物(intermetallic
compound, IMC)中,發現界面微結構與高鉍合金/銅基材相似,這顯
加而粗化,而Bi-5wt.%Sn 與Bi-10wt.%Sn 則生成層狀的Ni3Sn4。在
高鉍合金與鎳基材熱處理反應,生成的IMC 為Ni3Sn4,並隨著熱處
IMC 主要為Ni3Sn4 並且微溶2.9at.%金,迴焊反應IMC 主要為Ni3Sn2微溶4.2at%金。

In this study, the Bi-xSn(x=2,5,10wt.%Sn) alloys joined with the Cu and Ni substrates are used to investigate the interfacial reactions and shear strength of the high-Bi/Cu and high-Bi/Ni solder joint systems. For the high-Bi/Cu joints, there is only Cu3Sn formed at the interface. The Cu3Sn phase detached from the Cu substrate, and a Bi-rich layer existed between the Cu substrate and the Cu3Sn phase. We propose a possible mechanism to explain the detachment phenomenon of the Cu3Sn phase based on the ternary Sn-Bi-Cu isothermal section. For the high-Bi/Cu joints under solid-state aging, the Cu3Sn phase grew with increasing the aging time. At the same time, part of the Cu3Sn phase was transformed into the Cu6Sn5 phase. In the Bi-2wt.%Sn/Ag/Cu system, the Cu3Sn phase also detached from the Cu substrate after reflow for 15 sec. The Ag layer disappeared at the interface and dissolved into the high-Bi alloy and the intermetallic compound (IMC). The interfacial reaction of the Bi-2wt.%Sn/Ag/Cu is similar to the high-Bi/Cu aging reaction. Therefore, it is concluded that the addition of an Ag layer has no significant influence on the interfacial reactions of the high-Bi/Cu joints.
In the Bi-2wt.%Sn/Ni system, the product of the reflow reaction is the Ni3Sn2 phase, and this phase grew with increasing the reflow time. In the Bi-5wt.%Sn and Bi-10wt.%Sn/Ni systems, the product of the reflow reaction is the Ni3Sn4 phase, and the IMC became thicker as the reflow time increased. For the solid-state aging, the Ni3Sn4 phase grew with increasing the aging time. In the Bi-2wt.%Sn/Au/Ni system, the Au layer dissolved into the molten alloy and the IMC during the reflow reaction and aging reaction. Compared with the Bi-2wt.%Sn/Au/Ni and high-Bi alloy/Ni interfacial reactions, the interfacial morphologies are similar for these two systems.
According to the data of interfacial shear strength, the strength of the high-Bi alloy/Cu and Ni substrates are better than the Pb-5wt.%Sn/Cu and Ni substrates, so the high-Bi alloys have high potential to replace the high-lead solder
其他識別: U0005-0608201217110900
Appears in Collections:化學工程學系所

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