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|標題:||Deposition of AlGaN films on (111)Si substrates and optimization of GaN growth on Si using intermediate-temperature AlGaN buffer layers||作者:||龔志榮
|關鍵字:||nitrides;semiconductors;deposition process;optical properties;light-emitting-diodes;si(111);blue;aln;transistors;stress;movpe||Project:||Thin Solid Films||期刊/報告no：:||Thin Solid Films, Volume 493, Issue 1-2, Page(s) 135-138.||摘要:||
AlxGa1-xN films having various Al-contents were grown on (111) Si substrates over a temperature range of 800 similar to 1000 degrees C. It was found that crack free AlxGa1-xN films were achieved when the films were grown at 800 degrees C. High temperature (HT) GaN films were also deposited on (111) Si substrates using 800 degrees C grown AlxGa1-xN buffer layers with different thickness and composition combinations. The best HT GaN film was achieved on (111) Si substrate by process optimization with an 800 degrees C grown 180 nm-thick Al0.58Ga0.42N buffer layer. Room temperature photoluminescence (PL) spectrum of the HT GaN film shows a strong near band edge emission having a linewidth of 100 meV and a quenched yellow luminescence. It is believed that the use of intermediate temperature AlxGa1-xN buffer layer is beneficial to accommodate the misfit strain between HT GaN film and (111) Si substrate. (c) 2005 Elsevier B.V. All rights reserved.
|Appears in Collections:||物理學系所|
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