Please use this identifier to cite or link to this item:
|標題:||Adhesion investigation of low-k films system using 4-point bending test||作者:||Lee, C.C.
|關鍵字:||4-point bending;Interfacial crack;FEA;Adhesion;Thin film;dissimilar elastic-materials;bimaterial interface;crack penetration;deflection||Project:||Thin Solid Films||期刊/報告no：:||Thin Solid Films, Volume 517, Issue 17, Page(s) 4875-4878.||摘要:||
This research presents a simulation-based methodology to accurately predict interfacial adhesion behaviors of heterostructures. Validation of the proposed approach is achieved through comparison of 4-point bending test results on interfaces of multiple stacked low-k films with those of theoretical solutions from the finite element analysis. Impact induced by the compliance of 4-point bending test system can be neglected using the averaged energy release rate of various crack lengths in simulations. On the basis of precise predictions drawn from the considered analyses, uncertainty of experimental tests for the nano-scale fractured strength could be promptly observed and estimated. (C) 2009 Elsevier B.V. All rights reserved.
|Appears in Collections:||光電工程研究所|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.