Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/39927
標題: Adhesion investigation of low-k films system using 4-point bending test
作者: Lee, C.C.
張書通
Huang, J.
Chang, S.T.
Wang, W.C.
關鍵字: 4-point bending;Interfacial crack;FEA;Adhesion;Thin film;dissimilar elastic-materials;bimaterial interface;crack penetration;deflection
Project: Thin Solid Films
期刊/報告no:: Thin Solid Films, Volume 517, Issue 17, Page(s) 4875-4878.
摘要: 
This research presents a simulation-based methodology to accurately predict interfacial adhesion behaviors of heterostructures. Validation of the proposed approach is achieved through comparison of 4-point bending test results on interfaces of multiple stacked low-k films with those of theoretical solutions from the finite element analysis. Impact induced by the compliance of 4-point bending test system can be neglected using the averaged energy release rate of various crack lengths in simulations. On the basis of precise predictions drawn from the considered analyses, uncertainty of experimental tests for the nano-scale fractured strength could be promptly observed and estimated. (C) 2009 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/39927
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2009.03.135
Appears in Collections:光電工程研究所

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