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標題: 矽膠封裝膠材對於發光二極體特性 與壽命之影響
Effects of Silicone Encapsulant Materials on Performance and Lifetime of Light-Emitting Devices
作者: 羅杏芬
Lo, Sin-Fan
關鍵字: Encapsulation;封裝膠材;Silicone Resin;Surface Mount;light-Emitting Diode;有機矽樹脂;表面黏著型發光二極體
出版社: 精密工程學系所
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This thesis describes the effects of silicone encapsulant materials on the performance and lifetime of light-emitting devices (LEDs). It is well known that the development of LED packaging materials needs to take account of the low heat stress, low water absorbability, high adherence, bearing the soldering tin temperature, mechanical intensity, and the electrical test. Once the conventional epoxy package encountered with the overheated temperature, the polymer molecular bond configuration would be broken and produced undesirable free radicals. This will deteriorate the packaging material and results in the yellowing problem; i.e. making the white light LED have the chromatic polarization phenomenon.
It has been reported that the silicone encapsulation is anti-UV and anti-yellowing. In this study, the influence of silicone encapsulation on the performance of white light LED is investigated. The effects of short wavelength and the chip heating on the LED lamp was examined. It was found that the high refraction index of the silicone encapsulation for the yellow chip showed 2.16 times enhancement in output power as obtained from the integral sphere. From the measurements of Fourier transform infrared spectra, the essential chemical bond of the silicone encapsulation is of benzene ring structure. However, the packaging material with the benzene ring showed evident brightness degradation after the reliability test. The optimization of the encapsulation materials for the bare chips becomes an important issue for high brightness LEDs with high reliability.
其他識別: U0005-0502200712082700
Appears in Collections:精密工程研究所

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