Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4064
標題: 銅-錫介金屬生成反應與外在應力關係之探討
Study external stress effects on Copper-Tin intermetallic formation
作者: 李幸男
Li, Shin-Nan
關鍵字: four point bend;四點彎矩法;stress effects;IMC;外加應力;介金屬
出版社: 精密工程學系所
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摘要: 
本實驗使用四點彎矩法探討外加應力對銅錫介金屬生成的影響。本實驗試片製備採用400μm厚度的銅片電鍍不同種類之純錫 (霧錫與亮錫) 25μm,將試片切割成長27mm寬5mm的大小進行實驗。
將試片分別施予不同應力狀態後(拉伸、壓縮、不受力)放入200度的熱風烘箱中進行老化處理。研究結果顯示IMC生長會受不同老化時間與不同層級外加應力的影響,無論是外加拉伸或壓縮應力皆會影響IMC生長。
當霧錫試片受到壓縮應力時,其IMC厚度會大於不受力時,當霧錫試片受到拉伸應力時,其IMC厚度會小於不受力時,整體IMC厚度生長趨勢為試片受壓應力>試片不受力>試片受拉應力。另一方面,亮錫試片無論受到壓縮應力時,或拉伸應力時,其IMC生長厚度均會大於不受力時,整體IMC厚度生長趨勢為試片受應力>試片不受力。而霧錫與亮錫與銅反應後所生成的IMC結構有所差異。

A four point bend experiments were conducted to study the stress effects on Cu-Sn IMC growth. Two kinds of Tin samples (Matte and Bright) were prepared. 400μm Cu sheet were cut into strips with 27mm in length and 5mm in width as test samples. 25μm tin (Matte or Bright) was deposited on top of copper sheet using electroplating. A set of samples were put into furnace at 200C and bending stress were applied under tension, compression and without stress. The results on intermetallic formation affected by different stress levels and aging time were presented. Both of tension and compression stress would affect the Cu-Sn IMC formation. The thickness of IMC was increased when Matte tin sample under compressive stress and decreased when Matte tin sample under tensile stress, both of them are compared to the Matte tin sample without stress and the trend is Compression > Control > Tension. On the other hand, the thickness of IMC was increased when Bright tin sample under stress and the trend is Compression and Tension> Control. The growth rate of IMC was faster in Bright tin under stress .The IMC structures from different Tin sources present very differently.
URI: http://hdl.handle.net/11455/4064
其他識別: U0005-2208201111385200
Appears in Collections:精密工程研究所

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