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標題: 應用於矽微麥克風之高感度振膜研究
A Study of High Sensitivity Diaphragm for Silicon Microphone Applications
作者: 林宗潁
Lin, Zong-Ying
關鍵字: electret condenser microphone;駐極體電容式麥克風;mechanical sensitivity;diaphragm;backplate;frequency range;機械感度;振膜;背板;頻率響應
出版社: 精密工程學系所
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本論文提出駐極體電容式矽微麥克風應用於高靈敏度的振膜設計與分析。一般來說,駐極體電容式矽微麥克風的靈敏度取決於電感度與振膜的機械感度。高的機械感度可以由振膜材料的機械特性所決定。為了獲得高靈敏度的矽微麥克風,我們採用低張應力的振膜材料特性與大面積的振膜來製作振膜晶片。在這項研究過程中,其駐極體電容式矽微麥克風的空間層距離與背板厚度分別為16 μm與120 μm。
評估聚醯亞胺(Polyimide)、環氧樹脂(SU-8)和氮化矽(Si3N4)的振膜材料製作各式各樣的薄膜厚度與面積的振膜晶片結構。從實驗結果中可得知Polyimide比SU-8、Si3N4的振膜材料更可以獲得良好的矽微麥克風靈敏度。另一方面,較大的振膜面積也可使麥克風獲得較高的靈敏度。在最佳的Polyimide結構下(直徑=1600 μm、厚度=0.6 μm),且內部偏壓為-130 V時,於1 KHz的取樣下所量測得到的響應值為-40.9 dBV/Pa,相當於感度9 mV/Pa。

This paper presents the design and analysis of high sensitive diaphragm for electret condenser microphone applications. In general, the sensitivity of electret condenser microphone depends on the electrical sensitivity and the mechanical sensitivity of the diaphragm. The high mechanical sensitivity can be determined by the mechanical properties of the diaphragm. In order to obtain high sensitive microphones, the properties of low tensile stress and larger area of the diaphragms were fabricated. In this study, the spacer and the thickness of the backplate of electret microphone are 16 μm and 120 μm, respectively.
The diaphragm made of polyimide, SU-8, and Si3N4 materials with various thickness and area were evaluated. It was found that the diaphragm made of polyimide presents the better sensitivity as compared with that made of SU-8 and Si3N4 materials. On the other hand, the larger area of diaphragm results in the higher sensitivity of the microphone. Under the optimized polyimide structure (diameter=1600
其他識別: U0005-1207200622374600
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