Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4088
標題: 以新式微拉伸設備量測次微米尺度材料機械性質
Using a new microtensile system to measure the mechanical properties of sub-micron thick thin film materials
作者: 童麒嘉
Tong, Chi-Jia
關鍵字: microtensile;微拉伸;sub-micron;mechanical properties;次微米;機械性質
出版社: 精密工程學系所
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摘要: 
在此篇論文中針對目前文獻中微拉伸試驗上負載對準的問題加以改進,以自行架設之微拉伸試驗機量測薄膜材料的機械行為,並設計一新式電鍍製程製作微拉伸試件,提升試件製作的速率與良率。利用此微拉伸試驗機已分別測得不同的薄膜材料(Au, TaN, Cu)的楊氏係數(Young’s modulus)、降伏應力(yield stress)等機械性質。

In this research, we present a novel designed microtensile test apparatus that is capable of measuring the mechanical properties of free-standing thin film materials. We also develop a new fabrication method using the electroplating technique to fabricate the spring structure and frame of the microtensile test sample. With this new setup, we can increase the sample fabricate success rate and yield. In addition, we can also eliminate the loading misalignment problem of the previous microtensile tests. Adopting this new approach, we have successfully measured the mechanical properties (Young's modulus, yield stress and ultimate stress) of several thin film materials.
URI: http://hdl.handle.net/11455/4088
其他識別: U0005-1307200620020400
Appears in Collections:精密工程研究所

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