Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41064
標題: Effects of silver doping on electromigration of eutectic SnBi solder
作者: Chen, C.M.
陳志銘
Huang, C.C.
關鍵字: electromigration;solder;Sn;Bi;Ag;phase-diagram;bi;joints;evolution;failure;copper;alloy
Project: Journal of Alloys and Compounds
期刊/報告no:: Journal of Alloys and Compounds, Volume 461, Issue 1-2, Page(s) 235-241.
摘要: 
Effects of silver doping on electromigration behavior of the eutectic SnBi solder are investigated. Electromigration can induce the Bi migration along with the direction of electron flow in the eutectic SnBi solder, thus Bi depletes at the cathode side but accumulates at the anode side. Plate-like Ag3Sn compound is formed as 0.5 wt% silver is doped into the solder. The Ag3Sn plates behave like roadblocks which can intercept the Bi migration from the cathode side to the anode side. Consequently, a great inconsistency is found between the Bi depletion at the cathode side and the Bi accumulation at the anode side. (C) 2007 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/41064
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2007.07.059
Appears in Collections:化學工程學系所

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