Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4145
標題: 以微拉伸試驗量測微米尺度下錫與錫銅介金屬之材料機械行為
Using a microtensile system to measure the mechanical properties of micro Sn and Cu-Sn intermetallics thin film materials
作者: 王子義
Wang, Zi-Yi
關鍵字: microelectronic package;微電子封裝;mechanical properties;microtensile test;機械行為;微拉伸
出版社: 精密工程學系所
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摘要: 
在微電子封裝中銲錫接點對於整體元件可靠性扮演重要的角色,因此本篇論文探討純錫在微米尺度時材料機械行為,並設計多種以半導體製程與微電鑄製作微拉伸試件之製程,再以微拉伸系統對試件進行量測,錫之楊氏係數為42.6GPa。此外,對於複合層(Sn-IMC-Cu)薄膜運用等效彈簧的概念計算出介金屬層之楊氏係數為94.2GPa。

Solder joints play an important role for all devices in microelectronic package.In this research,we investigated mechanical properties of pure Sn thin film in micron scale and designed many kinds of micro fabrication processes along with microelectroplate to fabricate microtensile test samples .Then we measured mechanical properties with a microtensile system.Finally,we used the concept of equivalent spring to calculate Young's modulus of intermetallic compound with multilayers thin film.
URI: http://hdl.handle.net/11455/4145
其他識別: U0005-2108200715232500
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