Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4145
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dc.contributor黃德劭zh_TW
dc.contributor張守一zh_TW
dc.contributor鍾官榮zh_TW
dc.contributor陳志銘zh_TW
dc.contributor.advisor林明澤zh_TW
dc.contributor.author王子義zh_TW
dc.contributor.authorWang, Zi-Yien_US
dc.contributor.other中興大學zh_TW
dc.date2008zh_TW
dc.date.accessioned2014-06-06T06:27:07Z-
dc.date.available2014-06-06T06:27:07Z-
dc.identifierU0005-2108200715232500zh_TW
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dc.identifier.urihttp://hdl.handle.net/11455/4145-
dc.description.abstract在微電子封裝中銲錫接點對於整體元件可靠性扮演重要的角色,因此本篇論文探討純錫在微米尺度時材料機械行為,並設計多種以半導體製程與微電鑄製作微拉伸試件之製程,再以微拉伸系統對試件進行量測,錫之楊氏係數為42.6GPa。此外,對於複合層(Sn-IMC-Cu)薄膜運用等效彈簧的概念計算出介金屬層之楊氏係數為94.2GPa。zh_TW
dc.description.abstractSolder joints play an important role for all devices in microelectronic package.In this research,we investigated mechanical properties of pure Sn thin film in micron scale and designed many kinds of micro fabrication processes along with microelectroplate to fabricate microtensile test samples .Then we measured mechanical properties with a microtensile system.Finally,we used the concept of equivalent spring to calculate Young's modulus of intermetallic compound with multilayers thin film.en_US
dc.description.tableofcontents第一章 序論 ……………………………………………………………1 1.1 研究緣起 ……………………………………………………1 1.2 研究動機 ……………………………………………………8 1.3 研究目的 ……………………………………………………9 第二章 文獻探討 ……………………………………………………11 2.1 導論…………………………………………………………11 2.2 無鉛錫球的發展……………………………………………22 2.2.1 熔點 …………………………………………………23 2.2.2 機械強度 ……………………………………………23 2.2.3 抗腐蝕性與抗氧化性 ………………………………23 2.2.4 濕潤性 ………………………………………………23 2.2.5 價格低廉 ……………………………………………24 2.2.6 Sn-Au合金……………………………………………25 2.2.7 Sn-Ag合金……………………………………………25 2.2.8 Sn-Cu合金……………………………………………26 2.2.9 Sn-Bi合金……………………………………………26 2.2.10 Sn-In合金 …………………………………………27 2.2.11 Sn-Zn合金 …………………………………………28 2.2.12 Sn-Ag-Cu合金 ………………………………………28 2.3薄膜機械性質測試回顧………………………………………35 2.3.1 晶片彎曲法……………………………………………35 2.3.2 晶格常數應變量測法…………………………………38 2.3.3 奈米壓痕法……………………………………………39 2.3.4 微型樑彎矩測試法……………………………………41 2.3.5 膨脹測試法……………………………………………44 2.3.6 微拉伸試驗法…………………………………………46 第三章 試件設計與製作………………………………………………49 3.1 前言 …………………………………………………………49 3.2 試件結構設計 ………………………………………………50 3.3 製程設計 ……………………………………………………54 3.3.1 初始試件製程設計……………………………………54 3.3.2 第二次製程設計………………………………………60 3.3.3 第三次製程設計………………………………………63 3.3.4 第四次製程設計………………………………………68 3.3.5 第五次製程設計………………………………………74 第四章 設備與實驗方法………………………………………………78 4.1 前言 …………………………………………………………78 4.2 微拉伸系統……………………………………………………79 4.2.1 微拉伸系統設計的演變 ………………………………79 4.2.2 實驗系統 ………………………………………………81 第五章 結果與討論……………………………………………………86 5.1 25um錫薄膜 …………………………………………………86 5.2 錫銅介金屬 …………………………………………………92 5.3 結論與未來展望 ……………………………………………94 參考文獻 ………………………………………………………………95zh_TW
dc.language.isoen_USzh_TW
dc.publisher精密工程學系所zh_TW
dc.relation.urihttp://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-2108200715232500en_US
dc.subjectmicroelectronic packageen_US
dc.subject微電子封裝zh_TW
dc.subjectmechanical propertiesen_US
dc.subjectmicrotensile testen_US
dc.subject機械行為zh_TW
dc.subject微拉伸zh_TW
dc.title以微拉伸試驗量測微米尺度下錫與錫銅介金屬之材料機械行為zh_TW
dc.titleUsing a microtensile system to measure the mechanical properties of micro Sn and Cu-Sn intermetallics thin film materialsen_US
dc.typeThesis and Dissertationzh_TW
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.openairetypeThesis and Dissertation-
item.cerifentitytypePublications-
item.fulltextno fulltext-
item.languageiso639-1en_US-
item.grantfulltextnone-
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