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Investigation of High Sensitive Electret Condenser Microphones Using Low Stress Diaphragms
|關鍵字:||electret condenser microphone;駐極體電容式麥克風;wafer transfer technology;sacrificial layer;frequency response;脫離技術;犧牲層;頻率響應||出版社:||精密工程學系所||引用:|| http://discoverychannel.com.tw/technology/history/index.shtml  http://users.pandora.be/oldmicrophones/microphone_history.htm  D. Hohm and R. Gerhard-Multhaupt, “Silicon-dioxide electret transducer,” Journal of The Acoustical Society America, vol. 75, pp. 1297-1298, 1984.  A. J. Sprenkels, R. A. Groothengel, A. J. Verloop, and P. Bergveld, “Development of an electret microphone in silicon,” Sensors and Actuators, vol. 17, pp. 509-512, 1989.  J. H. Jerman, D. J. Clift, and S. R. Mallinson, “A Miniature Fabry Perot Interferometer with a Corrugated Silicon Diaphragm Support,” Tech. Digest IEEE Solid-State Sensor and Actuator Workshop, pp. 140-144, 1990.  J. Bergqvist and F. Rudolf, “A new condenser microphone in silicon, “ Sensors and Actuators A, vol.21, pp. 123-125, 1990.  J. Bergqvist, F. Rudolf, J. Maisano, F. Parodi, and M. 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駐極體電容式微麥克風的靈敏度主要取決於電感度與振膜的機械感度。高的機械感度可以由振膜材料的機械特性所決定。為了獲得高靈敏度的微麥克風，我們選用低應力的振膜材料Parylene與Polyimide配合大面積的振膜尺寸來製作振膜晶片。脫離後的振膜結構(直徑=1900 µm、厚度=1.05 µm)，於1 kHz之取樣頻率，並由駐極體材料所提供的-304 V偏壓下所量測，可得到-38.1 dBV/Pa的增益輸出，相當於全感度約為12.45 mV/Pa。相較於已市售之STAR microphone 型號MAA-03A-L與KNOWLES microphone型號MB3015ASC-2響應值皆為-44 dBV/Pa，感度為6.3 mV/Pa，本論文之感度明顯的較STAR microphone與KNOWLES microphone優良許多。
In this thesis, we have developed a high sensitive assembly electret condenser microphone using wafer transfer technology. An electret microphone mainly consists of three parts: a diaphragm, an electret backplate and a spacer. Moreover, in the previous condenser microphone developments, there were two types of fabrication processes by wafer bonding and single chip fabrication. The cost of wafer bonding process is high, and the high-temperature wafer-bonding technique was not easy compatible with Si circuits. On the other hand, the single chip process was complex and not easy to fabricate. Here, wafer-transferring technique was provided. It could prevent the drawbacks mentioned above. Additionally, the wafer-transferring fabrication could keep the sensitive diaphragm of microphone after dicing and package.
The sensitivity of electret condenser microphone depends on the electrical sensitivity and the mechanical sensitivity of the diaphragm. The high mechanical sensitivity can be determined by the mechanical properties of the diaphragm. In order to obtain high sensitive microphones, the properties of low tensile stress and larger area of the diaphragms were fabricated. The diameter and thickness of the diaphragm are 1900 µm and 1.05 µm, respectively. The response of microphone is -38.1 dBV/Pa, (@1 kHz, bias voltage of -304 V). It is corresponding to the sensitivity of 12.45 mV/Pa . The response of STAR microphone and KNOWLES microphone both are -44 dBV/Pa. It is corresponding to the sensitivity of 6.3 mV/Pa. The result of this thesis is better than that of the commercial product.
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