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|標題:||Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders||作者:||Chen, C.M.
|關鍵字:||Electromigration;Sn-9 wt.% Zn;Bi;Cu;Microstructure;sn/ni interfacial reactions;pb-free solder;atomic migration;microstructure;failure;alloys;joints;interconnect;segregation;copper||Project:||Journal of Alloys and Compounds||期刊/報告no：:||Journal of Alloys and Compounds, Volume 475, Issue 1-2, Page(s) 238-244.||摘要:||
Stripe-type Cu/solder/Cu reaction couples were utilized to investigate electromigration behaviors of Sn-8Zn-3Bi and Sn-9Zn-1Cu (in wt.%) solders under current stressing with a density of 10(5) A/cm(2) at 80-125 degrees C. Two cooling conditions, fan and furnace cooling, were performed after the solders was reflowed on the Cu stripe. No noticeable microstructural change was found in the fan-cooled Sn-8Zn-3Bi solder at 80 degrees C except that Bi migrated along with the electron flow toward the anode. While significant microstructural change was found at 125 degrees C, indicating that electromigration effect is enhanced at higher temperatures. Sn was extruded in front of the Cu electrode at the anode side and voids were formed in the solder near the cathode side. For the furnace-cooled solder, microstructural change was found even at 80 degrees C. For the Sn-9Zn-1Cu solder, regardless of fan or furnace cooling, Sn extrusion and voids were formed at the anode and cathode sides, respectively, after current stressing at 80 degrees C. Voids were formed in the solder and mainly surrounded the Cu-Zn compounds. (c) 2008 Elsevier B.V. All rights reserved.
|Appears in Collections:||化學工程學系所|
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