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|標題:||Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate||作者:||Lin, C.P.
|關鍵字:||Intermetallics;Metals and alloys;Diffusion;Microstructure;evolution;films||Project:||Journal of Alloys and Compounds||期刊/報告no：:||Journal of Alloys and Compounds, Volume 502, Issue 2, Page(s) L17-L19.||摘要:||
Sn/Ag/Cu tri-layer structure was frequently encountered in microelectronic solder joints. In flexible microelectronics, the Sn/Ag/Cu tri-layer structure was usually subjected to strain when the plastic substrate was deformed. This study investigated the Sn/Ag/Cu interfacial reactions on a polyimide substrate subjected to compressive and tensile strain. Under both strain conditions, the Sn/Ag/Cu tri-layer structure was replaced by the multi-layer structure of Sn/Ag(3)Sn/Cu(6)Sns/Cu(3)Sn/Cu after 150 and 200 degrees C of aging. However, blocky Cu(6)Sn(5) was formed at the Sn/Ag(3)Sn interface subjected to compressive strain but rarely observed at that subjected to tensile strain, revealing that strain was an influential factor to the Sn/Ag/Cu interfacial reactions. (C) 2010 Elsevier B.V. All rights reserved.
|Appears in Collections:||化學工程學系所|
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