Please use this identifier to cite or link to this item:
|標題:||Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow||作者:||Chen, C.H.
|關鍵字:||Interfacial reaction;Sn-9wt.% Zn solder;Cu;substrate thickness;sn-zn solder;intermetallic compounds;ni;microstructure;metallization;substrate;couples;sn-9zn;joints;ag||Project:||Journal of Electronic Materials||期刊/報告no：:||Journal of Electronic Materials, Volume 38, Issue 1, Page(s) 61-69.||摘要:||
Interfacial reactions between Sn-9wt.%Zn solder and Cu substrates at 230A degrees C were investigated. The substrate thickness was found to have noticeable effects on the evolution of the reaction products formed at the solder/Cu interface. The CuZn(5) and Cu(5)Zn(8) phases were formed at the early stage of reflow, regardless of the Cu thickness, while, with increasing reflow time, the two phases displayed different growth behaviors on the Cu substrates with various thicknesses. For the thicker Cu substrates with a thickness of 6 mu m, 10 mu m, and 0.5 mm, CuZn(5) disappeared but Cu(5)Zn(8) kept on growing after a longer reflow time. In contrast, for the thinner Cu substrates with a thickness less than 3 mu m, Cu(5)Zn(8) shrank with increasing reflow time but CuZn(5) grew dominantly. A different evolution of the grain morphology of CuZn(5) was also observed between the thicker and thinner Cu substrates. When the reflow time was increased, the CuZn(5) grains retained a rounded shape on the thinner Cu substrates; however, the grain structure became faceted on the thicker Cu substrates.
|Appears in Collections:||化學工程學系所|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.