Please use this identifier to cite or link to this item:
|標題:||Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board||作者:||Lin, C.P.
|關鍵字:||Solid-state bonding;immersion Ag;surface finishing;interfacial;reaction;au/ni surface finish;ag eutectic solder;immersion silver;cu;joints;growth;packages;strength;copper||Project:||Journal of Electronic Materials||期刊/報告no：:||Journal of Electronic Materials, Volume 38, Issue 6, Page(s) 908-914.||摘要:||
Immersion Ag is a promising candidate Pb-free surface finish on printed circuit boards (PCBs). For flexible PCB and optoelectronic packaging, solid-state bonding rather than reflow is commonly used to join the chips to the PCB with Sn-based solders, after which the immersion Ag layer remains at the joint interface and participates in the interfacial reactions at the solder joints. Solder joint samples composed of a Sn/Ag/Cu trilayer on flexible PCBs were prepared to study the interfacial reactions at 150A degrees C and 200A degrees C. Three phases, Ag(3)Sn, Cu(6)Sn(5), and Cu(3)Sn, were sequentially formed at the interface. Remarkable change of the morphology of the Ag(3)Sn phase was observed during thermal aging. The thickness of the immersion Ag layer was found to have significant effects on the growth rates of the Cu(6)Sn(5) and Cu(3)Sn phases and the void formation in the Cu(3)Sn phase.
|Appears in Collections:||化學工程學系所|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.