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|標題:||Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering||作者:||Wang, K.Z.
|關鍵字:||interfacial reaction;high-lead 95Pb5Sn solder;Ti/Cu/Ni under bump;metallization (UBM);behavior;sn;metallurgy;systems;tin;pb;cu||Project:||Journal of Electronic Materials||期刊/報告no：:||Journal of Electronic Materials, Volume 34, Issue 12, Page(s) 1543-1549.||摘要:||
Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization (UBM) during 350 degrees C reflow for durations ranging from 50 see to 1440 min were investigated. A thin intermetallic layer of only 0.4 mu m thickness was formed at the 95Pb5Sn/UBM interface after reflow for 5 min. When the reflow was extended to 20 min, the intermetallic layer grew thicker and the phase identification revealed the intermetallic layer comprised two phases, (Ni,Cu)(3)Sn-2 and (Ni,Cu)(3)Sn-4. The detection of the Cu content in the intermetallic compounds indicated that the Cu atoms had diffused through the Ni layer and took part in the intermetallic compound formation. With increasing reflow time, the (Ni,Cu)(3)Sn-4 phase grew at a faster rate than that of the (Ni,Cu)(3)Sn-2 phase. Meanwhile, irregular growth of the (Ni,Cu)(3)Sn-4 phase was observed and voids formed at the (Ni,Cu)(3)Sn-2/Ni interface. After reflow for 60 min, the (Ni,Cu)(3)Sn-2 phase disappeared and the (Ni,Cu)(3)Sn-4 phase spalled off the Ni layer in the form of a continuous layer. The gap between the (Ni,Cu)(3)Sn-4 layer and the Ni layer was filled with lead. A possible mechanism for the growth, disappearance, and spalling of the intermetallic compounds at the 95Pb5Sn/UBM interface was proposed.
|Appears in Collections:||化學工程學系所|
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