Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41569
DC FieldValueLanguage
dc.contributor.authorChen, C.M.en_US
dc.contributor.author陳志銘zh_TW
dc.contributor.authorChen, C.H.en_US
dc.contributor.authorLin, C.P.en_US
dc.contributor.authorSu, W.C.en_US
dc.date2008zh_TW
dc.date.accessioned2014-06-06T08:05:39Z-
dc.date.available2014-06-06T08:05:39Z-
dc.identifier.issn0361-5235zh_TW
dc.identifier.urihttp://hdl.handle.net/11455/41569-
dc.description.abstractThe morphological evolution of the reaction product formed at the Sn-9wt.%Zn/thin-film Cu interface under reflow and solid-state aging was investigated. The Cu thin film was rapidly consumed and converted to CuZn(5) and Cu(5)Zn(8) at the interface after reflow for 1 min. Upon increasing reflow time, the Cu(5)Zn(8) compound was transformed into CuZn(5), followed by grain ripening. CuZn(5) grains grew bigger and the number of grains decreased. During the reflow process, CuZn(5) grains showed a round and convex surface morphology. During solid-state aging, a different morphological evolution of CuZn(5) grains was observed. The surface morphology of the grains became more planar after solid-state aging for 24 h. In addition, the grain surface fractured severely, implying that a compressive stress was created at the interface. After a longer duration of solid-state aging, the grain surface changed into a more faceted morphology. Potential mechanisms of the morphological evolution and fracture of the CuZn(5) grains are also discussed.en_US
dc.language.isoen_USzh_TW
dc.relationJournal of Electronic Materialsen_US
dc.relation.ispartofseriesJournal of Electronic Materials, Volume 37, Issue 10, Page(s) 1605-1610.en_US
dc.relation.urihttp://dx.doi.org/10.1007/s11664-008-0517-1en_US
dc.subjectSn-9wt.%Znen_US
dc.subjectCu thin filmen_US
dc.subjectCuZn(5)en_US
dc.subjectmorphologyen_US
dc.subjectsn-zn solderen_US
dc.subjectintermetallic compoundsen_US
dc.subjectnien_US
dc.subjectmicrostructureen_US
dc.subjectmetallizationen_US
dc.subjectsubstrateen_US
dc.subjectcouplesen_US
dc.titleMorphological evolution of the reaction product at the Sn-9wt.%Zn/thin-film Cu interfaceen_US
dc.typeJournal Articlezh_TW
dc.identifier.doi10.1007/s11664-008-0517-1zh_TW
item.languageiso639-1en_US-
item.openairetypeJournal Article-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.fulltextno fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
Appears in Collections:化學工程學系所
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