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|標題:||Morphological evolution of the reaction product at the Sn-9wt.%Zn/thin-film Cu interface||作者:||Chen, C.M.
|關鍵字:||Sn-9wt.%Zn;Cu thin film;CuZn(5);morphology;sn-zn solder;intermetallic compounds;ni;microstructure;metallization;substrate;couples||Project:||Journal of Electronic Materials||期刊/報告no：:||Journal of Electronic Materials, Volume 37, Issue 10, Page(s) 1605-1610.||摘要:||
The morphological evolution of the reaction product formed at the Sn-9wt.%Zn/thin-film Cu interface under reflow and solid-state aging was investigated. The Cu thin film was rapidly consumed and converted to CuZn(5) and Cu(5)Zn(8) at the interface after reflow for 1 min. Upon increasing reflow time, the Cu(5)Zn(8) compound was transformed into CuZn(5), followed by grain ripening. CuZn(5) grains grew bigger and the number of grains decreased. During the reflow process, CuZn(5) grains showed a round and convex surface morphology. During solid-state aging, a different morphological evolution of CuZn(5) grains was observed. The surface morphology of the grains became more planar after solid-state aging for 24 h. In addition, the grain surface fractured severely, implying that a compressive stress was created at the interface. After a longer duration of solid-state aging, the grain surface changed into a more faceted morphology. Potential mechanisms of the morphological evolution and fracture of the CuZn(5) grains are also discussed.
|Appears in Collections:||化學工程學系所|
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