Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41590
標題: Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing
作者: Chen, C.M.
陳志銘
Hung, Y.M.
Lin, C.P.
Su, W.C.
關鍵字: Alloys;Electronic materials;Microstructure;Precipitation;sn/ni interfacial reactions;electromigration;copper;joint;evolution
Project: Materials Chemistry and Physics
期刊/報告no:: Materials Chemistry and Physics, Volume 115, Issue 1, Page(s) 367-370.
摘要: 
Microstructural changes of the Sn-9wt.% Zn solder stripe under current stressing with a density of 105 A cm(-2) at 80-140 degrees C for 240 h were investigated. Two different cooling conditions furnace and fan, cooling, were used in the reflow of the solder. Sn hillocks/whiskers were formed across the furnace-cooled solder stripe, mainly in front of the coarse Zn-rich precipitates and the anode-side Cu electrode, at all temperatures. In the fan-cooled solder stripe, the microstructure was almost unchanged at 80 and 100 degrees C, but changes significantly at 140 degrees C where large quantities of solder were depleted but accumulated at the cathode and anode sides, respectively. Temperature was found to be an important factor that affected the electromigration behavior of the Sn-Zn solder and its influence was more significant in the fan-cooled solder. (C) 2008 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/41590
ISSN: 0254-0584
DOI: 10.1016/j.matchemphys.2008.12.019
Appears in Collections:化學工程學系所

Show full item record
 

Google ScholarTM

Check

Altmetric

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.