Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/41795
標題: Formulation and characterization of UV-light-curable electrically conductive pastes
作者: Cheng, W.T.
鄭文桐
Chih, Y.W.
Lin, C.W.
關鍵字: formulation;characterization;dispersion;granular shape;flake shape;silver;UV light;photo-DSC;electrically conductive paste;adhesive joints;reliability;performance;composites;thickness
Project: Journal of Adhesion Science and Technology
期刊/報告no:: Journal of Adhesion Science and Technology, Volume 19, Issue 7, Page(s) 511-523.
摘要: 
UV-light-curable electrically conductive pastes have been formulated from granular silver particles and flake-shaped silver and epoxyacrylate, ethylene glycol and photo-initiator in this study. These conductive pastes were analyzed using photo-DSC, TGA and conductivity metry for reaction rate during photo-polymerization process, thermal resistance and conductivity, respectively. It is shown that (1) the rate of photo-polymerization can be regulated by varying the exposure dose and time depending on the particle size and particle loading; (2) the resistance of the paste containing 60 wt% silver with mean particle size from 0.6 to 1.5 mu m is reduced to 5.63 x 10(-7) Omega cm; and (3) with granular-shaped silver with 0.6 to 3.5 mu m in diameter the decomposition temperature of electrically conductive paste is 424 degrees C, while the temperature of thermal decomposition is 397 degrees C for the same solid content of flake shape silver with length 0.5 to 5 mu m, after photo-polymerization using a radiation dose of 500 mJ/cm(2).
URI: http://hdl.handle.net/11455/41795
ISSN: 0169-4243
DOI: 10.1163/1568561054352522
Appears in Collections:化學工程學系所

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