Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/4180
標題: 電磁致動之雙穩態機構
Electromagnectically actuated bistable micromechanisms
作者: 謝易翰
Hsieh, Yi-Han
關鍵字: MEMS;微機電系統;electrodeposition;sacrificial layer;compliant bistable mechanism;electromagnetic force;電沉積;犧牲層;撓性雙穩態機構;電磁式致動器
出版社: 精密工程學系所
引用: 參考文獻 國科會精密儀器發展中心,2003,微機電系統技術與應用,初版,精密儀器發展中心出版,新竹市。 陳建人,民國92年,微機電系統技術與應用,行政院國家科學委員會精密儀器發展中心出版。 王大倫 譯,民國86年,實用電鍍學,財團法人徐氏基金會。 Akiyama, T., Collard, D., and Fujita, H., (1997), “Scratch Drive Actuator with Mechanical Links for Self-assembly of Three Dimensional MEMS,” Journal of Microelectromechanical Systems, Vol. 6, pp. 10-17. Smits, J.G., (1992), “Design Consideration of a Piezoelectric-on-Silicon Microrobot,” Sensors and Actuators, Vol. 35, No. 2, pp. 129-135. Ballandras, S., Daniau, W., Basrour, S., and Robert, L., (1995), “Deep Etch X-ray Lithography Using Silicon-gold Masks Fabricated by Deep Etch UV Lithography and Electroforming,” Journal Micromechanics and Microengineering, Vol, 5, pp. 203-208. Becker, E.W., Ehrfeld, W., Hagmann, P., Maner, A., and Muchmeyer, D., (1986), “Fabrication of microstructures with high aspect ration and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding(LIGA process),” Microelectronic Engineering, Vol. 4, pp. 35-36. Butler, J.T., Bright, V.M., and Cowan, W.D., (1999), “Average Power Control and Positioning of Polysilicon Thermal Actuators,” Sensors and Actuators A, Vol. 72, pp. 88-97. Chu, P.B., and Pister, K.S., (1994), “Analysis of Closed-loop Control of Parallel-plate Electrostatic Microgrippers,” IEEE International Conference on Robotics and Automation, pp. 820-825. Comtois, J.H., and Bright, V.M., (1997), “Applications for Surface-Micromachined Polysilicon Thermal Actuators and Arrays,” Sensors and Actuators, Vol. 51, No. 1, pp. 19-25. Comtois, J.H, Bright, V.M, and Phipps, M., (1995), “Thermal Micro-Actuators for Surface- Micromaching Process,” Proceedings SPIE Micro-machined Devices and Components, Vol. 2642, pp. 10-21. Fujita, H., (1989), “Microactuators for Micro-motion System,” The Third Toyota Conference, pp. 279-295. Guckel, H., Klein, J., Christenson, T., Skrobis, K., Laudon, M., and Lovell, E.G., (1992), “Thermo-Magnetic Metal Flexure Actuators,” Solid-State Sensor and Actuator Workshop, 5th Technical Digest, IEEE, pp. 73 -75. Hayashi, T., (1999), “Research and Development of Micromechanisms”, Proceedings of Tenth World Congress on the Theory of Machine and Mechanisms, pp. 18-23. Parkinson, M.B., Jensen, B.D., and Roach, G.M., (2000), “Optimization-Based Design of a Fully-Compliant Bistable Micromechanism,” Proceedings of DETC 00 ASME 2000 Design Engineering Technical Conferences and Computers and Information in Engineering Conference Baltimore, pp. 1-7. Que, L., Park, J. S., and Gianchandani, Y. B., (1999), “Bent-beam Electro-thermal Actuators for High Force Applicators,” Micro Electro Mechanical Systems, MEMS ‘99. Twelfth IEEE International Conference, pp. 17 –21. Riethmuller, W., and Benecke, W., (1988), “Thermally Excited Silicon Microactuators”, IEEE Transactions On Electron Devices, Vol 35, No. 6, pp. 758-763. Romankiw, L.T., (1997), “A path: from electroplating through lithographic masks in electronics to LIGA in MEMS,” Electrochimica Acta, Vol. 42, No. 20-22, pp. 2985 -3005. Wagner, B., and Benecke, W., (1991), “Microfabricated Actuator With Moving Permanent Magnet,” Proceeding IEEE MEMS¬’91, Nara, Japan, 27, pp. 27-32. Sun, X., Farmer, K.R., and Carr, M.N., (1998), “A Bistable Microrelay Based on Twosegment Multimorph Cantilever Actuators,” Proceedings of IEEE Workshop on MEMS, pp. 154-159. Yang, Y.J., Liao, B.T., and Kuo, W.C., (2007), “A Novel 2 × 2 MEMS Optical Switch Using the Split Cross-bar Design,” Journal of Micromechanics and Microengineering, Vol. 17, pp. 875-882.
摘要: 
本文是探討ㄧ個由電磁式致動器驅動之撓性雙穩態機構,此雙穩態機構之主要性能如作動位移量大小、運動方向、及致動電流等,皆為研究探討之對象。輸入電流於雙穩態機構後,分析撓性雙穩態機構之位移量以及其反作用力的變化來判斷其是否具有雙穩態特性。
在分析模擬方面,使用國家高速網路與計算中心 (NCHC) 所提供之 ABAQUS 6.4 有限元素分析模擬軟體來進行模擬,分析模擬電磁式致動器的雙穩態特性及其結構之變形,並觀察撓性雙穩態機構之位移量以及其反作用力大小的關係。
在製程方面,本研究採用 UV-LIGA 製程,取代傳統的矽基微加工製程,利用微影製程與電沉積製程,在玻璃基板上製作出鎳金屬雙穩態微結構。本研究以犧牲層的技術,利用銅、鎳金屬之間附著性良好與蝕刻選擇比大的特性,製作出懸空的雙穩態微結構,並使用兩階段電流密度的沉積方式來製作微結構,以改善電沉積時常有鍍層粗糙度不佳的情形。
URI: http://hdl.handle.net/11455/4180
其他識別: U0005-1707200810581200
Appears in Collections:精密工程研究所

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