Please use this identifier to cite or link to this item:
標題: 影像模組之熱傳性能研究與散熱對策
Thermo-Dynamic Diagnostics and Heat Dissipation Strategy for Image Modules
作者: 陳振宜
Chen, Chen-I
關鍵字: Thermograph;熱影像;Heat dissipation;Image sensor;散熱;影像感測
出版社: 精密工程學系所
引用: [1] L. T. Young, J. J. Gerbrands, and L. J. V. Vliet, “Fundamentals of Image Processing,” Delft University of Technology, 2nd ed, pp.33-35, 1998. [2] Y. Guangbin, “Life Cycle Reliability Engineering,” Wiley, 1st ed, pp.237-256, 2007. [3] B. R. Archambeault, “PCB Design for Real-World EMI control,” IBM Technologies Inc., 1st ed, pp.7-9, 2003. [4] D. Clein, “CMOS IC Layout,” Newnes, 1st ed, p.83-87, 1999. [5] W. K. Pratt, “Digital Image Processing,” Wiley, 4th ed, pp.127-133, 2007. [6] J. P. Colinge and C. A. Colinge, “Physics of Semiconductor Devices,” Springer, 1st ed, pp.29-30, 2005. [7] Serway and Jewett, “Physics for Scientists and Engineers,” Thomson Books, 6th ed, pp.605-630, 2004. [8] L. M. Jiji, “Heat Convection,” Springer, 1st ed, pp.299-301, 2006. [9] S. V. Patankar, “Numerical Heat Transfer and Fluid Flow,” Hemisphere Publishing Corporation, 1st ed, pp.113-137, 1980. [10] A. Bar-Cohen, Proceedings of the IEEE, Vol.73, pp.1388-1395, 1985. [11] E. Yu and Y. K. Joshi, IEEE Transactions on Components and Packaging Technologies, Vol.23, pp.14-22, 2000. [12] R. S. Lee, H. C. Huang, and W. Y. Chen, 6th IEEE SEMI-THERM Symposium, pp.95-102, 1990. [13] R. W. Knight, J. S. Goodling, and B. E. Gross, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.15, pp.754-760, 1992. [14] C. D. Mandrone, K. Azar, and J. M. Segelken, 9th IEEE SEMI -THERM Symposium, pp.19-27, 1993. [15] I. Sauciuc, M. Mochizuki, K. Mashiko, Y. Saito, and T. Nguyen, 16th IEEE SEMI-THERM Symposium, pp.27-32, 2000. [16] D. G. Wang, IEEE/CMPT Electronics Packaging Technology Conference, pp.133-137, 1998. [17] T. Y. T. Lee, J. A. Andrews, P. Chow, and D. Saums, Components, Hybrids, and Manufacturing Technology, Vol.15, pp.786-793, 1992. [18] T. D. Hund, 40th ECTC Processing, Vol.1, pp.436-441, 1990. [19] S. Speaks, “Reliability and MTBF Overview,” Vicor Reliability Engineering, pp.5-7, 2000. [20] JEDEC Solid State Technology Association, “Guidelines for Reporting and using Electronic Package Thermal Information,“ JESD51-12, pp.8-17, 2005.
本論文利用紅外線熱影像分析影像模組的電路板之溫度分佈,藉由零件溫度的高低歸納出主要的熱源所在,再依此分成兩大項研究。首先針對溫度高的位置設置排除熱能的散熱機構,並探討散熱器對電路板散熱上的實質效益。其次是評估電路板設計上的零件位置及佈線方式,以尋求最符合電路設計之最佳化走線佈局。為了確保電路板上的影像感測器、數位訊號處理器能工作於適當的溫度範圍,本論文藉由整合熱傳分析所預設的模擬以及實際量測數據之交互驗證下,提出針對主要熱源之處可改善10 %的散熱效能之方法。

Most commercial image modules for image sensing and capturing are developed to be small in size and have more functionalities. How to achieve the optimum design under the limited usable space is the future trend in product development. In the current development process of the image module, since an electrical engineer usually only considers the correctness of signal transmission and the compensating functionalities, more regulated-circuits, signal-controller ICs, and signal-routes are added during processing the layout of a printed circuit board (PCB). After compromising to the circuit control rules, the PCB with size like a match-box has been jammed with various electronic components. However, the heat caused by these components is totally ignored.
This thesis utilizes the Infrared-Thermograph to analysis actual temperature distribution of the PCB, generalizes the main heat source from the temperatures of the components, and then divides into two research categories. First, the heat dissipation mechanisms are provided on the high temperature position of the PCB. Then, its actual heat dissipation effect is studied. Second, the position and the layout of the components are evaluated to find out the optimum layout of the PCB that fulfills the requirements of the circuit design rules. In order to guarantee the operating temperatures of the image-sensor and the DSP on the PCB to be within a suitable range, this thesis provides an improved method by alternately verifying the simulated data from the heat-transfer analysis and the actual measured data that improve 10 % heat dissipation effect of the main heat source.
其他識別: U0005-2108200807462900
Appears in Collections:精密工程研究所

Show full item record

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.