Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/42052
標題: Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting Diodes
作者: Horng, R.H.
洪瑞華
Hong, J.S.
Tsai, Y.L.
Wuu, D.S.
Chen, C.M.
Chen, C.J.
武東星
陳志銘
關鍵字: Composite solder;light-emitting diodes (LEDs);thermal resistance
Project: Ieee Transactions on Electron Devices
期刊/報告no:: Ieee Transactions on Electron Devices, Volume 57, Issue 9, Page(s) 2203-2207.
摘要: 
To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat spreader is a cup-shaped copper sheet, which was directly contacted with sapphire to enhance heat dissipation of the chip itself. The second heat spreader is the die-bonding material of diamond-added AgSnCu solder and a high thermal conductive metal-core printed circuit board (MCPCB), where the conventional dielectric layer was replaced with a thin diamond-like layer. Characterization results demonstrate that the diamond-added composite solder is useful in reducing LED thermal resistance, thus avoiding the thermal accumulation phenomenon. In addition, a LED packaged on the new MCPCB exhibits smaller total thermal resistance and larger light output power.
URI: http://hdl.handle.net/11455/42052
ISSN: 0018-9383
DOI: 10.1109/ted.2010.2053492
Appears in Collections:化學工程學系所

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