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|標題:||Improvement of thermal management of high-power GaN-based light-emitting diodes||作者:||Liou, Bo-Hung
|Project:||Microelectronics Reliability, Volume 52, page(s) 861–865.||摘要:||
The thermal management of high-power light-emitting-diode (LED) devices employing various die-attach
materials is analyzed. Three types of die-attach materials are tested, including silver paste, Sn–3 wt.% Ag–
0.5 wt.% Cu (SAC305) solder, and SAC305 solder added with a small amount of carbon nanotubes (CNTs).
The analysis of thermal management is performed by comparing the temperatures of the LED chips in use
and the total thermal resistances of the LED devices obtained respectively from the thermal infrared
images and thermal transient analysis. Due to the high thermal conductivity of CNT, the addition of CNTs
into the SAC305 solder reduces the total thermal resistance and chip temperature of the LED device, and
the thermal management of the LED devices is improved accordingly.
|Appears in Collections:||化學工程學系所|
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