Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/43632
標題: Emergence of Ag particles and their effects on the mechanical properties of TaN-Ag nanocomposite thin films
作者: Tseng, C.C.
張守一
Hsieh, J.H.
Wu, W.
Chang, S.Y.
Chang, C.L.
吳威德
關鍵字: co-sputtering;nanocomposite thin films;TaN-Ag;C-AFM;reactive sputter-deposition;electrical-properties;coatings;hard
Project: Surface & Coatings Technology
期刊/報告no:: Surface & Coatings Technology, Volume 201, Issue 24, Page(s) 9565-9570.
摘要: 
TaN-Ag nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 350 degrees C for 2, 4, 8 min respectively to induce the nucleation and growth of Ag particles in TaN matrix and on film surface. C-AFM (Conductive Atomic force Microscopy) and FESEM (Field-Emission Scanning Electron Microscopy) were applied to examine the Ag nano-particles emerged on the surface of these thin films. A nano-indenter and a pin-on-disk tribometer were used to study the effect of annealing on the films' mechanical properties. The results reveal that annealing by RTA can cause Ag nano-particles to emerge on the TaN surface. Consequently, the mechanical properties of the films will vary depending on annealing conditions, Ag content, and Ag particle emergence. (c) 2007 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/43632
ISSN: 0257-8972
DOI: 10.1016/j.surfcoat.2007.04.033
Appears in Collections:材料科學與工程學系

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