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標題: Wafer-bonded AlGaInP/Au/AuBe/SiO2/Si light-emitting diodes
作者: Horng, R.H.
Wuu, D.S.
Wei, S.C.
Tseng, C.T.
Huang, M.F.
Chang, K.H.
Liu, P.H.
Lin, K.C.
關鍵字: AlGaInP;LED;mirror substrate;wafer bonding;absorbed-substrate;joule;heatin;quantum efficiency;ingaalp
Project: Japanese Journal of Applied Physics Part 1-Regular Papers Short Notes & Review Papers
期刊/報告no:: Japanese Journal of Applied Physics Part 1-Regular Papers Short Notes & Review Papers, Volume 39, Issue 4B, Page(s) 2357-2359.
An AlGaInP light-emitting diode (LED) with a Au/AuBe/SiO2/Si mirror substrate has been successfully fabricated by the wafer bonding technique. The mirror-substrate LED is capable of emitting luminous intensity of 90 mcd under 20 mA injection. It is clearly far superior to the conventional absorbed-substrate LED with a distributed Bragg reflector structure (less than or equal to 1 mcd). This device exhibits normal p-n diode behavior with a forward voltage of less than 2 V operating at 20 mA. The leakage current is about 3 nA under a 36V reverse bias. This result indicates that the wafer bonding technique does not adversely affect the I-V characteristic of the LED device. Moreover, the emission wavelength of the bonded LED was independent of the injection current. The low forward series resistance and the Si substrate providing a good heat sink solve the joule heating problem inherent in conventional LEDs.
ISSN: 0021-4922
DOI: 10.1143/jjap.39.2357
Appears in Collections:材料科學與工程學系

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