Please use this identifier to cite or link to this item:
標題: High-performance transparent barrier films of SiOx/SiNx stacks on flexible polymer substrates
作者: Chen, T.N.
Wuu, D.S.
Wu, C.C.
Chiang, C.C.
Chen, Y.P.
Horng, R.H.
關鍵字: light-emitting devices;coatings;plasma;polycarbonate;adhesion
Project: Journal of the Electrochemical Society
期刊/報告no:: Journal of the Electrochemical Society, Volume 153, Issue 10, Page(s) F244-F248.
A transparent barrier structure consisting of silicon oxide (SiOx)/silicon nitride (SiNx) stacks was deposited on a polycarbonate substrate at 80 degrees C by plasma-enhanced chemical vapor deposition. Details of radio-frequency (rf) power effects on the SiOx and SiNx film properties in terms of etching rate, refractive index, internal stress, and water vapor transmission rate (WVTR) were investigated. It was found that the impermeability, flexibility, and optical property of the SiOx/SiNx barrier films can be tailored by varying the rf power. A gradual decrease in the compressive internal stress of each stack film was designed to prevent the stress-induced cracks during the multilayer deposition process. The WVTR value of the optimum barrier structure (SiNx + 6 pairs of SiOx/SiNx) can reduce to 3.12 x 10(-6) g/m(2)/day under a calcium test (100 days at 25 degrees C, 40% relative humidity). After 5000 cyclic bending tests in a compressive mode, the WVTR value can keep below 3.54 x 10(-5)g/m(2)/day. The performance of the SiOx/SiNx barrier stacks presented has high potential for future flexible electronics applications. (c) 2006 The Electrochemical Society.
ISSN: 0013-4651
DOI: 10.1149/1.2335592
Appears in Collections:材料科學與工程學系

Show full item record

Google ScholarTM




Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.