Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/44100
DC FieldValueLanguage
dc.contributor.authorHuang, S.Y.en_US
dc.contributor.author洪瑞華zh_TW
dc.contributor.authorHorng, R.H.en_US
dc.contributor.authorLiu, P.L.en_US
dc.contributor.authorWu, J.Y.en_US
dc.contributor.authorWu, H.W.en_US
dc.contributor.authorWuu, D.S.en_US
dc.contributor.author武東星zh_TW
dc.contributor.author劉柏良zh_TW
dc.date2008zh_TW
dc.date.accessioned2014-06-06T08:11:54Z-
dc.date.available2014-06-06T08:11:54Z-
dc.identifier.issn1041-1135zh_TW
dc.identifier.urihttp://hdl.handle.net/11455/44100-
dc.description.abstractGreen light vertical-conducting resonant-cavity light-emitting diodes.(RCLEDs) have been fabricated on a Cu substrate by the combination of laser lift-off and plating techniques. The structure of the RCLED/Cu is consisted of the InGaN-GaN multiple-quantum-well active layer between three layers of the dielectric TiO2-SiO2 distributed Bragg reflector as a top mirror and an Al metal layer as a bottom mirror. It was found that the RCLED with Cu substrate presents superior thermal dissipation and a stable electroluminescence emission peak wavelength (similar to 507 nm) under a high injection current. It is attributed to the Cu substrate providing a good heat sink and effectively reducing the junction temperature.en_US
dc.language.isoen_USzh_TW
dc.relationIeee Photonics Technology Lettersen_US
dc.relation.ispartofseriesIeee Photonics Technology Letters, Volume 20, Issue 9-12, Page(s) 797-799.en_US
dc.relation.urihttp://dx.doi.org/10.1109/lpt.2008.921120en_US
dc.subjectInGaNen_US
dc.subjectjunction temperatureen_US
dc.subjectlaser lift-off (LLO)en_US
dc.subjectresonant-cavityen_US
dc.subjectlight-emitting diode (RCLED)en_US
dc.subjectmolecular-beam epitaxyen_US
dc.subjectmirrorsen_US
dc.titleThermal stability improvement of vertical conducting green resonant-cavity light-emitting diodes on copper substratesen_US
dc.typeJournal Articlezh_TW
dc.identifier.doi10.1109/lpt.2008.921120zh_TW
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.fulltextno fulltext-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.languageiso639-1en_US-
item.openairetypeJournal Article-
Appears in Collections:材料科學與工程學系
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