Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/44399
標題: (Plasma Processes and Polymers, 04(2):180-185)Improvements of permeation barrier coatings using encapsulated parylene interlayers for flexible electronic applications
作者: T. N. Chen
D. S. Wuu
C. C. Wu
C. C. Chiang
Y. P. Chen
R. H. Horng
關鍵字: barrier;flexible electronics;multilayers;parylene;water-vapor permeability
出版社: Weinheim, Germany:WILEY-VCH Verlag GmbH & Co. KGaA
Project: Plasma Processes and Polymers, Volume 4, Issue 2, Page(s) 180-185.
URI: http://hdl.handle.net/11455/44399
ISSN: 1612-8869
Appears in Collections:材料科學與工程學系

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