Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/44399
DC FieldValueLanguage
dc.contributor.advisor武東星zh_TW
dc.contributor.advisorD. S. Wuuen_US
dc.contributor.authorT. N. Chenen_US
dc.contributor.authorD. S. Wuuen_US
dc.contributor.authorC. C. Wuen_US
dc.contributor.authorC. C. Chiangen_US
dc.contributor.authorY. P. Chenen_US
dc.contributor.authorR. H. Horngen_US
dc.contributor.other國立中興大學材料科學與工程學系zh_TW
dc.date2007zh_TW
dc.date.accessioned2014-06-06T08:12:14Z-
dc.date.available2014-06-06T08:12:14Z-
dc.identifier.issn1612-8869zh_TW
dc.identifier.urihttp://hdl.handle.net/11455/44399-
dc.language.isoen_USzh_TW
dc.publisherWeinheim, Germany:WILEY-VCH Verlag GmbH & Co. KGaAen_US
dc.relationPlasma Processes and Polymers, Volume 4, Issue 2, Page(s) 180-185.en_US
dc.subjectbarrieren_US
dc.subjectflexible electronicsen_US
dc.subjectmultilayersen_US
dc.subjectparyleneen_US
dc.subjectwater-vapor permeabilityen_US
dc.title(Plasma Processes and Polymers, 04(2):180-185)Improvements of permeation barrier coatings using encapsulated parylene interlayers for flexible electronic applicationsen_US
item.fulltextno fulltext-
item.grantfulltextnone-
item.languageiso639-1en_US-
Appears in Collections:材料科學與工程學系
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