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標題: Experimental study of heat sink performance using copper foams fabricated by electroforming
作者: Chein, R.Y.
Yang, H.H.
Tsai, T.H.
Lu, C.J.
關鍵字: metal foams;fluid-flow;convection;fin
Project: Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems
期刊/報告no:: Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, Volume 16, Issue 7, Page(s) 1157-1164.
In this study, performance of heat sinks using the copper foams as heat-sinking material is investigated experimentally. The copper foam is fabricated by electroforming technique using polymer foam with pre-coated silver film as the precursors. The manufactured copper foams have the porosity, pore density (pore per inch, PPI), permeability and inertial coefficient in the ranges of 0.5-0.8, 10-40, 0.6-2 x 10(-9) m(2) and 1.5-3, respectively. Besides the copper-foam heat sink, performances of single-channel, plate-fin and pin-fin heat sinks are also investigated and compared with copper-foam heat sinks. The experimentally measured results show that the thermal resistances of copper-foam heat sinks are better than the single-channel, plate-fin and pin-fin heat sinks because of special flow features inside the porous media, enlarged heat-transfer area and enhanced heat transfer coefficient. Detail comparisons between the results of copper-foam heat sinks indicate that the thermal resistance of copper-foam heat sink decreases with the decrease in porosity and increase in pore density. The pressure drop crossing the copper-foam heat sink increases with the increase in pore density and decrease in porosity.
ISSN: 0946-7076
DOI: 10.1007/s00542-009-0950-y
Appears in Collections:電機工程學系所

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