Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/44947
DC FieldValueLanguage
dc.contributor.authorDai, C.L.en_US
dc.contributor.author戴慶良zh_TW
dc.contributor.authorLiu, M.C.en_US
dc.date2007zh_TW
dc.date.accessioned2014-06-06T08:14:09Z-
dc.date.available2014-06-06T08:14:09Z-
dc.identifier.issn0021-4922zh_TW
dc.identifier.urihttp://hdl.handle.net/11455/44947-
dc.description.abstractThis study investigates the fabrication of an integrated pressure sensor using the commercial 0.35 mu m complementary metaloxide-semiconductor (CMOS) process and a post-process. The main character of the pressure sensor is to integrate the circuits on a chip. The pressure sensor that is a capacitive type sensor is composed of 128 sensing cells in parallel, and each sensing cell contains a suspended membrane and a fixed electrode to form a parallel-plate sensing capacitor. The circuits are employed to convert the capacitance variation of the pressure sensor into the output voltage. The post-process uses etchants to etch the sacrificial layers to release the suspended membrane of the pressure sensor, and then low pressure chemical vapor deposition (LPCVD) parylene is utilized to seal the etching holes of the pressure sensor. Experimental results show that the pressure sensor has a sensitivity of 1.5 mV/(V.kPa) in the pressure range of 0-200 kPa.en_US
dc.language.isoen_USzh_TW
dc.relationJapanese Journal of Applied Physics Part 1-Regular Papers Brief Communications & Review Papersen_US
dc.relation.ispartofseriesJapanese Journal of Applied Physics Part 1-Regular Papers Brief Communications & Review Papers, Volume 46, Issue 2, Page(s) 843-848.en_US
dc.relation.urihttp://dx.doi.org/10.1143/jjap.46.843en_US
dc.subjectpressure sensoren_US
dc.subjectcircuitsen_US
dc.subjectpost-processen_US
dc.subjectbiomedical applicationsen_US
dc.subjectcmos processen_US
dc.subjectfabricationen_US
dc.subjectsien_US
dc.titleComplementary metal-oxide-semiconductor microelectromechanical pressure sensor integrated with circuits on chipen_US
dc.typeJournal Articlezh_TW
dc.identifier.doi10.1143/jjap.46.843zh_TW
item.cerifentitytypePublications-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.languageiso639-1en_US-
item.fulltextno fulltext-
item.grantfulltextnone-
item.openairetypeJournal Article-
Appears in Collections:機械工程學系所
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