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|標題:||Novel method for in situ monitoring of thickness of quartz during wet etching||作者:||Lee, C.Y.
|關鍵字:||plate wave sensor;in situ monitoring;IDT||Project:||Japanese Journal of Applied Physics Part 1-Regular Papers Brief Communications & Review Papers||期刊/報告no：:||Japanese Journal of Applied Physics Part 1-Regular Papers Brief Communications & Review Papers, Volume 44, Issue 10, Page(s) 7662-7666.||摘要:||
In this work, we present a novel method based on a plate wave sensor for the in situ monitoring of the thickness of quartz membranes during wet etching. Similarly to oscillators and resonators, some acoustic devices require the thickness of quartz membranes to be determined precisely. Precise control of the thickness of quartz membranes during wet etching is important, because the thickness strongly influences post processing and frequency control. Furthermore, the proposed plate wave sensor, allows the thickness of quartz membranes from a few mu m to hundreds of pm to be monitored in situ, which depends on the periodicity of an interdigital transducer (IDT). In summary, the proposed method for measuring the thickness of quartz membranes in real time has a high accuracy, is simple to set up and can be mass-produced. Also described herein are the principles of the method used, the detailed process flow, the measurement set up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 1 mu m, implying a close correspondence.
|Appears in Collections:||機械工程學系所|
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