Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/44953
標題: A maskless post-CMOS bulk micromachining process and its application
作者: Dai, C.L.
戴慶良
Chiou, J.H.
Lu, M.S.C.
關鍵字: sensor;microstructures;fabrication;technology
Project: Journal of Micromechanics and Microengineering
期刊/報告no:: Journal of Micromechanics and Microengineering, Volume 15, Issue 12, Page(s) 2366-2371.
摘要: 
This work investigates a post-CMOS (complementary metal-oxide semiconductor) bulk micromachining process for fabricating suspended microstructures. The advantage of the post-CMOS process is easy execution with low-cost maskless wet etching. The post-CMOS process involves wet etching to remove sacrificial layers, which are stacked layers formed from metal and via layers, to expose the silicon substrate. Then, KOH solution is employed to etch the silicon substrate to develop deep cavities and generate suspended structures. Many suspended structures, which include bridges and plates, are fabricated using the post-CMOS bulk micromachining process. With the same process, two devices that are a suspended micro inductor and a micro hot plate are manufactured successfully. Experimental results reveal that the maximum quality factor of the suspended micro inductor is 4.8 at 4 GHz, and the micro hot plate can generate a high temperature of 300 degrees C with an applied voltage of 4 V, which has excellent thermal isolation and heating effect.
URI: http://hdl.handle.net/11455/44953
ISSN: 0960-1317
DOI: 10.1088/0960-1317/15/12/019
Appears in Collections:機械工程學系所

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