Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/45019
標題: Analysis of microchannel heat sink performance using nanofluids
作者: Chein, R.Y.
簡瑞與
Huang, G.M.
關鍵字: microchannel heat sink;nanofluid;thermal conductivity;thermal;dispersion and particle volume fraction;thermal-conductivity;flow;nanoparticles;optimization;fluids
Project: Applied Thermal Engineering
期刊/報告no:: Applied Thermal Engineering, Volume 25, Issue 17-18, Page(s) 3104-3114.
摘要: 
In this study, silicon microchannel heat sink performance using nanofluids as coolants was analyzed. The nanofluid was a mixture of pure water and nanoscale Cu particles with various volume fractions. The heat transfer and friction coefficients required in the analysis were based on theoretical models and experimental correlations, In the theoretical model, nanofluid was treated as a single-phase fluid, In the experimental correlation, thermal dispersion due to particle random motion was included. The microchannel heat sink performances for two specific geometries, one with W-ch = W-tin, = 100 mu m and L-ch = 300 mu m, the other with W-ch = W-tin = 57 mu m and L-ch = 365 mu m, were examined. Because or the increased thermal conductivity and thermal dispersion effects, it was found that the performances were greatly improved for these two specific geometries when nanofluids were used as the coolants, In addition to heat transfer enhancement, the existence of nanoparticles in the fluid did not produce extra pressure drop because of small particle size and low particle volume fraction. (c) 2005 Elsevier Ltd. All rights reserved.
URI: http://hdl.handle.net/11455/45019
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2005.03.008
Appears in Collections:機械工程學系所

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