Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46413
標題: In-situ neural network process controller for copper chemical mechanical polishing
作者: Wang, G.J.
王國禎
Lin, B.S.
Chang, K.J.
關鍵字: copper chemical mechanical polishing;neural-networks;run-to-run;process control;feedback-control;ewma controller;control scheme
Project: International Journal of Advanced Manufacturing Technology
期刊/報告no:: International Journal of Advanced Manufacturing Technology, Volume 32, Issue 1-2, Page(s) 42-54.
摘要: 
Process control is one of the key methods to improve manufacturing quality. This research proposes a neural network based run-to-run process control scheme that is adaptive to the time-varying environment. Two multilayer feedforward neural networks are implemented to conduct the process control and system identification duties. The controller neural network equips the control system with more capability in handling complicated nonlinear processes. With the system information provided by this neural network, batch polishing time (T) an additional control variable, can be implemented along with the commonly used down force (p) and relative speed between the plashing pad and the plashed wafer (v). Computer simulations and experiments on copper chemical mechanical polishing processes illustrate that in drafting suppression and environmental changing adaptation that the proposed neural network based run-to-run controller (NNRTRC) performs better than the double exponentially weighted moving average (d-EWMA) approach. It is also suggested that the proposed approach can be further implemented as both an end-point detector and a pad-conditioning sensor.
URI: http://hdl.handle.net/11455/46413
ISSN: 0268-3768
DOI: 10.1007/s00170-005-0311-7
Appears in Collections:生醫工程研究所

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