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|標題:||Novel Microtensile Method for Monotonic and Cyclic Testing of Freestanding Copper Thin Films||作者:||Lin, M.T.
|關鍵字:||Stress-strain measurement of copper thin films;Cyclic creep of;submicron copper thin films;Microtensile testing;Fatigue testing of Cu;thin films;tensile behavior;nanoindentation technique;mechanical-properties;stress-relaxation;youngs modulus;grained films;gold-films;fatigue;thickness;aluminum||Project:||Experimental Mechanics||期刊/報告no：:||Experimental Mechanics, Volume 50, Issue 1, Page(s) 55-64.||摘要:||
This paper presents the results of new microtensile tests conducted to investigate the mechanical properties of submicron-thick freestanding copper films. The method, used in this study, allows the observation of materials response under uniaxial tensile loads with measurements of stress at strain rates up to 5.5 x 10(-4)/s. It also facilitates tension-tension fatigue experiments under a variety of mean stress conditions at cyclic loading frequencies to 20 Hz. The sample processes involve fabrication of a supporting frame with springs and alignment beams all made of electroplated nickel. Electroplating took place on top of a previously deposited sample rather than creating a structure by subtractive fabrication. Tensile sample loading is applied using a piezoelectric actuator. Load was measured using a capacitance gap sensor with a novel mechanical coupling to the sample. Tension-tension fatigue experiments were carried out with feedback to give load control. Fatigue tests were conducted on sputter-deposited 500 and 900 nm copper films with grain sizes similar to 50 nm. Fatigue life reached 10(5) cycles at low mean load, which decreased with an increase in the mean load. The results indicate decreasing plasticity with increasing mean load.
|Appears in Collections:||精密工程研究所|
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