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|標題:||Novel heat dissipation design for light emitting diode applications||作者:||Chang, C.C.
|Project:||Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems||期刊/報告no：:||Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, Volume 16, Issue 4, Page(s) 519-526.||摘要:||
The authors offer a new design in support of efficient heat dissipation for light emitting diodes (LEDs). In the first part of this paper we discuss improvements in LED packaging materials and layer assembly, and then describe the addition of a thin layer of electroplated copper to the LED base assembly to reduce thermal resistance and increase thermal diffusion efficiency. Also described is a three-dimensional finite element simulation that we performed to verify the proposed design (0.75, 1, and 3 W LED chip temperatures) and a LED heat transfer behavior analysis. The results indicate that the addition of a 9 mm(2) electroplated copper layer to the LED base assembly improved LED thermal dissipation by reducing chip temperature by 5A degrees C compared to LEDs without the copper layer packaging. In the second part of this paper we describe (a) our heat pipe system/heat sink design for LED illumination, and (b) experiments in which we changed both working fluid mass and rotation angle to determine their effects on heat pipe cooling. Our results indicate that the most efficient heat dissipation occurred when an added heat pipe was arranged horizontally. Good heat dissipation was observed for heat pipes containing 2.52 g of water (temperature reduced by 50A degrees C). Larger water volumes failed to dissipate additional heat due to the presence of steam inside the pipe.
|Appears in Collections:||精密工程研究所|
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