Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46630
標題: Cumulative heat effect in excimer laser ablation of polymer PC and ABS
作者: 楊錫杭
Wei, M.K.
Yang, H.
關鍵字: excimer laser ablation;micromachining;thermal effect;conductivity
Project: International Journal of Advanced Manufacturing Technology
期刊/報告no:: International Journal of Advanced Manufacturing Technology, Volume 21, Issue 12, Page(s) 1029-1034.
摘要: 
Analysis of the thermal effect and machining properties of PC (polycarbonate) and ABS (polyacrylonitrilebutadienestyrene) polymers when ablated using a KrF excimer laser is described. PC has less thermal effect on the geometric distortion than ABS in laser ablation. The cumulative heat during laser ablation results in geometric deformation in ABS micromachining. The number of laser pulses generates a greater geometric deformation in ABS than in PC according to experimental laser ablation observations. The PC ablation rate is proportional to the laser fluence, whereas ABS shows an exponential profile. The pulse repetition rate has no significant influence on PC during laser ablation, but affects the ablated patterns in ABS. During laser ablation, PC does not produce debris on the machining patterns, but debris is produced on the machining patterns with ABS.
URI: http://hdl.handle.net/11455/46630
ISSN: 0268-3768
DOI: 10.1007/s00170-002-1431-y
Appears in Collections:精密工程研究所

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