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|標題:||Ultra-fine machining tool/molds by LIGA technology||作者:||楊錫杭
|關鍵字:||excimer-laser||Project:||Journal of Micromechanics and Microengineering||期刊/報告no：:||Journal of Micromechanics and Microengineering, Volume 11, Issue 2, Page(s) 94-99.||摘要:||
Machining tools based on the excimer laser and x-ray lithography to make ultra-fine machining tool/molds are described in this paper. The lower high-aspect ratio resist molds are fabricated using the KrF excimer laser. The higher aspect-ratio resist molds are made using x-ray lithography. Both low and high aspect-ratio resist molds are then converted into metallic structures using electroforming, The NiCo/SiC microcomposite electroforming with low internal stress (similar to0 kg mm(-2)) and high hardness (>Hv500) shows its feasibility as mold materials. An example of 2 mm thick integrated circuit. (IC) packaging leadframe patterns using x-ray micromachining is illustrated to prove its feasible application. On the technical side, micro-structures with a high aspect ratio of 30 were developed using a graphite membrane based x-ray mask.
|Appears in Collections:||精密工程研究所|
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