Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46640
標題: Ultra-fine machining tool/molds by LIGA technology
作者: 楊錫杭
Yang, H.
Pan, C.T.
Chou, M.C.
關鍵字: excimer-laser
Project: Journal of Micromechanics and Microengineering
期刊/報告no:: Journal of Micromechanics and Microengineering, Volume 11, Issue 2, Page(s) 94-99.
摘要: 
Machining tools based on the excimer laser and x-ray lithography to make ultra-fine machining tool/molds are described in this paper. The lower high-aspect ratio resist molds are fabricated using the KrF excimer laser. The higher aspect-ratio resist molds are made using x-ray lithography. Both low and high aspect-ratio resist molds are then converted into metallic structures using electroforming, The NiCo/SiC microcomposite electroforming with low internal stress (similar to0 kg mm(-2)) and high hardness (>Hv500) shows its feasibility as mold materials. An example of 2 mm thick integrated circuit. (IC) packaging leadframe patterns using x-ray micromachining is illustrated to prove its feasible application. On the technical side, micro-structures with a high aspect ratio of 30 were developed using a graphite membrane based x-ray mask.
URI: http://hdl.handle.net/11455/46640
ISSN: 0960-1317
DOI: 10.1088/0960-1317/11/2/302
Appears in Collections:精密工程研究所

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