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|標題:||Microcomposite electroforming for LIGA technology||作者:||Chou, M.C.
|關鍵字:||alloys||Project:||Microsystem Technologies||期刊/報告no：:||Microsystem Technologies, Volume 7, Issue 1, Page(s) 36-39.||摘要:||
Effective methods to improve hardness and thickness uniformity in electroforming for the LIGA process to produce metallic microstructures are described. The result shows the internal stress of Ni-Co alloy deposit can be well tuned between 2 to -2 kg/mm(2) by adding a stress release agent into the electroplating bath. A secondary cathode is applied to improve the thickness uniformity in electroforming without loss plating rate at the center of the features.
|Appears in Collections:||精密工程研究所|
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