Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46660
標題: Microcomposite electroforming for LIGA technology
作者: Chou, M.C.
楊錫杭
Yang, H.
Yeh, S.H.
關鍵字: alloys
Project: Microsystem Technologies
期刊/報告no:: Microsystem Technologies, Volume 7, Issue 1, Page(s) 36-39.
摘要: 
Effective methods to improve hardness and thickness uniformity in electroforming for the LIGA process to produce metallic microstructures are described. The result shows the internal stress of Ni-Co alloy deposit can be well tuned between 2 to -2 kg/mm(2) by adding a stress release agent into the electroplating bath. A secondary cathode is applied to improve the thickness uniformity in electroforming without loss plating rate at the center of the features.
URI: http://hdl.handle.net/11455/46660
ISSN: 0946-7076
DOI: 10.1007/s005420000063
Appears in Collections:精密工程研究所

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